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http://dx.doi.org/10.5407/JKSV.2015.13.3.024

Analysis and Visualization of Temperature Field for Wafer Batch in Furnace  

Kang, Seung-Hwan (성균관대학교 대학원 기계공학과)
Lee, Seung Ho (성균관대학교 대학원 기계공학과)
Kim, Byeong Hoon (삼성전자 메모리사업부 D기술팀)
Ko, Han Seo (성균관대학교 기계공학부)
Publication Information
Journal of the Korean Society of Visualization / v.13, no.3, 2015 , pp. 24-28 More about this Journal
Abstract
The temperature of the wafer batch in the furnace was calculated and its visualized temperature field was analyzed. The main heat transfer mechanisms from the heater wall to the wafers were radiation and conduction, and the finite difference method was used to analyze the complex heat transfer including those two mechanisms. The visualized temperature field shows that the direction of the heat flux in the wafer batch varies during the heating process, and the heat in the wafer batch diffuses faster by conduction within the wafer than by radiation between the wafers, in the condition of the constant temperature at the heater wall and cap.
Keywords
Wafer Temperature; Radiation Heat Transfer; Finite Difference Method;
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