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http://dx.doi.org/10.7842/kigas.2021.25.5.1

Risk Assessment of Semiconductor PR Process based on Frequency Analysis of Flammable Material Leakage  

Park, Myeongnam (Dept. of Chemical Engineering, Myongji University)
Chun, Kwang-Su (Ministry of Environment, Chemical Safety Management Department)
Yi, Jinseok (GL Environment technology)
Shin, Dongil (Dept. of Disaster and Safety, Myongji University)
Publication Information
Journal of the Korean Institute of Gas / v.25, no.5, 2021 , pp. 1-10 More about this Journal
Abstract
Semiconductor Photo Resist (PR) automation equipment uses a mixture of several flammable substances, and when it leaks during the process, it can lead to various accidents, therefore, risk assessment is necessary. This study analyzed the frequency of leakage of Acetone and PGMEA used in PR automation equipment and the frequency at which such leakage could lead to a fire accident through the frequency analysis method, and evaluated the need for additional risk reduction measures in the current facility. Based on the process leak data and ignition probability data of IOGP, leak frequency analysis and ignition probability were derived, and the frequency of actual fire accidents was analyzed by combining them. The frequency of material leakage in semiconductor PR process is 7.30E-03/year, and fire accidents can occur by acetone that exists above the flash point when the material is leaked, the frequency was calculated at the level of 1.24E-05/year. According to the UK HSE, for a major accident occurring with a frequency of 1.24E-05/year, it is defined as "Broadly Acceptable", a level that does not require additional measures for risk reduction when it causes 7 or less deaths, and due to the process operated by two people, no additional risk reduction are required.
Keywords
semiconductor; photo resist; frequency analysis method; risk reduction;
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  • Reference
1 Kang, S., Lee, I., Moon, J. and Chon, Y., "Risk Analysis of Ammonia Leak in the Refrigeration Manufacturing Facilities", Journal of the Korean Institute of Gas, 21(1), 43-51, (2017)   DOI
2 Huang, S., Wu, K., "Health Risk Assessment of Photoresists Used in an Optoelectronic Semiconductor Factory", Risk Analysis, 39(12), 2625-2639, (2019)   DOI
3 Dan, S., Lee, C., Park, J., Shin, D. and Yoon, E. S., "Quantitative Risk Analysis of Fire and Explosion on the Top-Side LNG-Liquefaction Process of LNG-FPSO", Process Safety and Environmental Protection, 92(5), 430-441, (2014)   DOI
4 Kodoth, M., Aoyama, S., Sakamoto, J., Kasai, N., Khalil, Y., Shibutani, T. and Miyake, A., "Leak Frequency Analysis for Hydrogen-based Technology Using Bayesian and Frequentist Methods", Process Safety and Environmental Protection, 136, 148-156, (2020)   DOI
5 Boggs, A., "A Comparative Risk Assessment of Casting Solvents for Positive Photoresist", Applied Industrial Hygiene, 4(4), 81-87, (1989)   DOI
6 IOGP, "Risk Assessment data directory-Process release frequencies", IOGP Report 434-01, (2010)
7 John, S. 'A Guide To Quantitative Risk Assessment for Offshore Installations, SMPT, (1999)