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http://dx.doi.org/10.9766/KIMST.2020.23.5.435

Design of Microstructure by Evaluating the Effect of Thermal Barrier Coating's Microstructure on TGO Interface Stress  

Kim, Damhyun (School of Mechanical Engineering, Sungkyunkwan University)
Park, Kibum (School of Mechanical Engineering, Sungkyunkwan University)
Wee, SungUk (School of Mechanical Engineering, Sungkyunkwan University)
Kim, Keekeun (School of Mechanical Engineering, Sungkyunkwan University)
Park, Soo (School of Mechanical Engineering, Sungkyunkwan University)
Seok, Chang-Sung (Department of Mechanical Engineering, Sungkyunkwan University)
Publication Information
Journal of the Korea Institute of Military Science and Technology / v.23, no.5, 2020 , pp. 435-443 More about this Journal
Abstract
Thermal barrier coating(TBC) applied to fighter and turbine engines is a technology that improves the durability of core parts by lowering the surface temperature of base material. The thermal stress caused by mis-match of the coefficient of thermal expansion between the top coating and the TGO interface is the main cause of TBC breakage. Since the thermal stress is dependent on the microstructure of the TBC, designing microstructure of TBC can improve the durability as well as lower the thermal stress. In this study, the effect of coating thickness, volume of porosity and vertical cracking on the thermal stress was analyzed through finite element analysis. Through the analysis results, a design range of a microstructure that can improve the durability of thermal barrier coating by lowering thermal stress is proposed.
Keywords
Thermal Barrier Coating; Microstructure; Thermally Grown Oxide; Thermal Stress; Finite Element Method;
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