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http://dx.doi.org/10.14478/ace.2011.22.6.631

Effect of Size and Morphology of Silica Abrasives on Oxide Removal Rate for Chemical Mechanical Polishing  

Lee, Jinho (Eco Composite Materials Center, Korea Institute of Ceramic Engineering and Technology)
Lim, Hyung Mi (Eco Composite Materials Center, Korea Institute of Ceramic Engineering and Technology)
Huh, Su-Hyun (Young Il Chemiced Co., Ltd.)
Jeong, Jeong-Hwan (Eco Composite Materials Center, Korea Institute of Ceramic Engineering and Technology)
Kim, Dae Sung (Eco Composite Materials Center, Korea Institute of Ceramic Engineering and Technology)
Lee, Seung-Ho (Eco Composite Materials Center, Korea Institute of Ceramic Engineering and Technology)
Publication Information
Applied Chemistry for Engineering / v.22, no.6, 2011 , pp. 631-635 More about this Journal
Abstract
Spherical and non-spherical silica particles prepared by the direct oxidation were studied for the effect of the particle size and shape of these particles on oxide CMP removal rate. Spherical silica particles, which have 10~100 nm in size, were prepared by the direct oxidation process from silicon in the presence of alkali catalyst. The 10 nm silica particles were aggregated by addition of an acid, an alcohol, or a silane as an aggregation inducer between the particles. Two or more aggregated silica particles were used as a seed to grow non spherical silica particles in the direct oxidation process of silicon in the presence of alkali catalyst. The oxide removal rate of spherical silica particles increased with increasing an average particle size for spherical silica abrasives in the oxide CMP. It further increased non-spherical particles, compared with the spherical particles in the similar average particle size.
Keywords
silica sol; aggregation non-spherical particle; CMP slurry; oxide removal rate; PETEOS silicon wafer;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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