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Trends in Development of Thermally Conductive Polymer Composites  

Hong, Jinho (Department of Chemical Engineering, Inha University)
Shim, Sang Eun (Department of Chemical Engineering, Inha University)
Publication Information
Applied Chemistry for Engineering / v.21, no.2, 2010 , pp. 115-128 More about this Journal
Abstract
Recently the use heat sink material grows where the polymer filled with thermal conductive fillers effectively dissipates heat generated from electronic components. Therefore the management of heat is directly related to the lifetime of electronic devices. For the purpose of improving thermal conductivity of composites, fillers with excellent thermaly conductive behavior are commonly used. Polymer composites filled with thermally conductive particles have advantages due to their processibility, cheap price, and durability to the corrosion. This paper aims to review the thermal interface materials and their model equations for predicting the thermal conductivity of polymer composites, and to introduce the commercial thermal conductive fillers and their applications.
Keywords
thermal conductivity; polymer composite; thermal interface material; model;
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