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http://dx.doi.org/10.3740/MRSK.2019.29.11.703

Peeling Behavior of Backsheet according to Surface Temperature of Photovoltaic Module  

Kim, Jeong-Hun (Separation and Conversion Materials Laboratory, Korea Institute of Energy Research)
Lee, Jun-Kyu (Separation and Conversion Materials Laboratory, Korea Institute of Energy Research)
Ahn, Young-Soo (Separation and Conversion Materials Laboratory, Korea Institute of Energy Research)
Yeo, Jeong-Gu (Separation and Conversion Materials Laboratory, Korea Institute of Energy Research)
Lee, Jin-Seok (Separation and Conversion Materials Laboratory, Korea Institute of Energy Research)
Kang, Gi-Hwan (Photovoltaic Laboratory, Korea Institute of Energy Research)
Cho, Churl-Hee (Graduate School of Energy Science and Technology, Chungnam National University)
Publication Information
Korean Journal of Materials Research / v.29, no.11, 2019 , pp. 703-708 More about this Journal
Abstract
In this study, we investigate the relationship between the peeling behavior of the backsheet of a photovoltaic(PV) module and its surface temperature in order facilitate removal of the backsheet from the PV module. At low temperatures, the backsheet does not peel off whereas, at high temperatures, part of the backsheet remains on the surface of the PV module after the peeling process. The backsheet material remaining on the surface of the PV module is confirmed by X-ray diffraction(XRD) analysis to be poly-ethylene(PE). Differential scanning calorimetry(DSC) is also performed to investigate the interfacial characteristics of the layers of the PV module. In particular, DSC provides the melting temperature($T_m$) of laminated ethylene vinyl acetate(EVA) and of the backsheet on the PV module. It is found that the backsheet does not peel off below the $T_m$ of ethylene of EVA, while the PE layer of the backsheet remains on the surface of the PV module above the $T_m$ of the PE. Thus, the backsheet is best removed at a temperature between the $T_m$ of ethylene and that of PE layer.
Keywords
photovoltaic module; recycling; backsheet; peeling; DSC analysis;
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