1 |
A. Janotti and C. G. Van de Walle, Rep. Prog. Phys., 72, 126501 (2009).
DOI
|
2 |
C. W. Litton, D. C. Reynolds and T. C. Collins, Zinc Oxide Materials for Electronic and Optoelectronic Device Applications, 1st ed., p. 265, John Wiley & Sons, New York (2011).
|
3 |
U. Ozgur, D. Hofstetter and H. Morkoc, Proc. IEEE, 98, 1255 (2010).
|
4 |
A. B. Djurisic, A. M. C. Ng and X. Y. Chen, Prog. Quant. Electr., 34, 191 (2010).
DOI
|
5 |
S. Bagga, J. Akhtar and S. Mishra, AIP Conf. Proc., 1989, 020004 (2018).
|
6 |
R. Zhu and R. Yang, Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing, p. 39, Springer Nature, Cham, Switzerland (2018).
|
7 |
S. Xu, Y. Qin, C. Xu, Y. Wei, R. Yang and Z. L. Wang, Nat. Nanotechnol., 5, 366 (2010).
DOI
|
8 |
H. J. Lee, S. Y. Chung, Y. S. Kim and T. I. Lee, Nano Energy, 38, 232 (2017).
DOI
|
9 |
B. Kumar, K. Y. Lee, H. K. Park, S. J. Chae, Y. H. Lee and S. W. Kim, ACS Nano, 5, 4197 (2011).
DOI
|
10 |
Y. Hu, L. Lin, Y. Zhang and Z. L. Wang, Adv. Mater., 24, 110 (2012).
DOI
|
11 |
L. Lin, Y. Hu, C. Xu, Y. Zhang, R. Zhang, X. Wen and Z. L. Wang, Nano Energy, 2, 75 (2013).
DOI
|
12 |
S. Lee, S. H. Bae, L. Lin, Y. Yang, C. Park, S. W. Kim, S. N. Cha, H. Kim, Y. J. Park and Z. L. Wang, Adv. Funct. Mater., 23, 2445 (2013).
DOI
|
13 |
C. Liu, A. Yu, M. Peng, M. Song, W. Liu, Y. Zhang and J. Zhai, J. Phys. Chem. C, 120, 6971 (2016).
DOI
|
14 |
Y. Zhang, C. Liu, J. Liu, J. Xiong, J. Liu, K. Zhang, Y. Liu, M. Peng, A. Yu, A. Zhang, Y. Zhang, Z. Wang, J. Zhai and Z. L. Wang, ACS Appl. Mater. Interfaces, 8, 1381 (2016).
DOI
|
15 |
M. Son, H. Jang, M.-S. Lee, T.-H. Yoon, B. H. Lee, W. Lee and M.-H. Ham, Adv. Mater. Technol., 3, 1700355 (2018).
DOI
|
16 |
L. Serairi, D. Yu and Y. Leprince-Wang, Phys. Status Solidi C, 13, 1 (2016).
|
17 |
A. Asthana, H. A. Ardakani, Y. K. Yap and R. S. Yassar, J. Mater. Chem. C, 2, 3995 (2014).
DOI
|
18 |
Y. Gao and Z. L. Wang, Nano Lett., 7, 2499 (2007).
DOI
|
19 |
C. Majidi, M. Haataja and D. J. Srolovitz, Smart Mater. Struct., 19, 055027 (2010).
DOI
|
20 |
ABAQUS 2017, Dassault Systemes, Velizy-Villacoublay, France (2016).
|
21 |
M. de Jong, W. Chen, H. Geerlings, M. Asta and K. A. Persson, Sci. Data, 2, 150053 (2015).
DOI
|
22 |
X. Li, Y. Chen, A. Kumar, A. Mahmoud, J. A. Nychka and H. J. Chung, ACS Appl. Mater. Interfaces, 7, 20753 (2015).
DOI
|
23 |
W. H. H. Oo, L. V. Saraf, M. H. Engelhard, V. Shuttanandan, L. Bergman, J. Huso, and M. D. McCluskey, J. Appl. Phys., 105, 013715 (2009).
DOI
|
24 |
K. Nakamura, S. Higuchi and T. Ohnuma, J. Appl. Phys., 119, 114102 (2016).
DOI
|
25 |
E. J. Hearn, Mechanics of Materials Volume 2: An Introduction to The Mechanics of Elastic and Plastic Deformation of Solids and Structural Components, 2nd ed., p. 457, Butterworth-Heinemann, Oxford, England (1985).
|