1 |
S. H. Lee, H. Yashiro and S. Z. Kure-Chu, J. Korean Inst. Surf. Eng., 50, 432 (2017).
|
2 |
B. L Mordike and T Ebert, Mater. Sci. Eng.: A, 302, 37 (2001).
DOI
|
3 |
G. Song, A. Atrens, D. Stjohn, J. Nairn and Y. Li, Corros. Sci., 39, 855 (1997).
DOI
|
4 |
Y. Ma, X. Nie, D. O. Northwood and H. Hu, Thin Solid Films, 494, 296 (2006).
DOI
|
5 |
J. Gray and B. Luan, J. Alloys Compd., 336, 88 (2002).
DOI
|
6 |
P. B. Srinivasan, C. Blawert and W. Dietzel, Mater. Sci. Eng.: A, 494, 401 (2008).
DOI
|
7 |
Y. Zhang, C. Yan, F. Wang, H. Lou and C. Cao, Surf. Coat. Technol., 161, 36 (2002).
DOI
|
8 |
H. Duan, K. Du, C. Yan and F. Wang, Electrochim. Acta, 51, 2898 (2006).
DOI
|
9 |
T. S. Narayanan, I. S. Park and M. H. Lee, Prog. Mater. Sci., 60, 1 (2014).
DOI
|
10 |
L. Wang, J. Zhou, J. Liang and J. Chen, Surf. Coat. Technol., 206, 3109 (2012).
DOI
|
11 |
R. O. Hussein, D. O. Northwood and X. Nie, Surf. Coat. Technol., 237, 357 (2013).
DOI
|
12 |
S. J. Xia, R. Yue, R. G. Rateick Jr. and V. I. Birss., J. Electrochem. Soc., 151, B179 (2004).
DOI
|