Browse > Article
http://dx.doi.org/10.3740/MRSK.2017.27.7.386

Bonding Properties of 14K White-Red Gold Alloy by Diffusion Bonding Process  

Song, Jeongho (Department of Materials Science and Engineering, University of Seoul)
Song, Ohsung (Department of Materials Science and Engineering, University of Seoul)
Publication Information
Korean Journal of Materials Research / v.27, no.7, 2017 , pp. 386-391 More about this Journal
Abstract
Using a customized diffusion bonder, we executed diffusion bonding for ring shaped white gold and red gold samples (inner, outer diameter, and thickness were 15.7, 18.7, and 3.0 mm, respectively) at a temperature of $780^{\circ}C$ and applied pressure of 2300 N in a vacuum of $5{\times}10^{-2}$ torr for 180 seconds. Optical microscopy, field emission scanning electron microscopy (FE-SEM), and energy-dispersive X-ray spectroscopy (EDS) were used to investigate the microstructure and compositional changes. The mechanical properties were confirmed by Vickers hardness and shear strength tests. Optical microscopy and FE-SEM confirmed the uniform bonding interface, which was without defects such as micro pores. EDS mapping analysis confirmed that each gold alloy was 14K with the intended composition; Ni and Cu was included as coloring metals in the white and red gold alloys, respectively. The effective diffusion coefficient was estimated based on EDS line scanning. Individual values of Ni and Cu were $5.0{\times}10^{-8}cm^2/s$ and $8.9{\times}10^{-8}cm^2/s$, respectively. These values were as large as those of the melting points due to the accelerated diffusion in this customized diffusion bonder. Vickers hardness results showed that the hardness values of white gold and red gold were 127.83 and 103.04, respectively, due to solid solution strengthening. In addition, the value at the interface indicated no formation of intermetallic compound around the bonding interface. From the shear strength test, the sample was found not to be destroyed at up to 100,000 gf due to the high bonding strength. Therefore, these results confirm the successful diffusion bonding of 14K white-red golds with a diffusion bonder at a low temperature of $780^{\circ}C$ and a short processing time of 180 seconds.
Keywords
gold alloys; diffusion bonding; Vickers hardness; diffusion coefficient;
Citations & Related Records
연도 인용수 순위
  • Reference
1 X. J. Zhang, K. K. Tong, R. Chan and M. Tan, J. Mater. Process. Technol., 48, 603 (1995).   DOI
2 C. F. Shaw, Chem. Rev., 99, 2589 (2009).
3 L. Ming, S. Yang and C. Cheng, Resour. Policy, 47, 125 (2016).   DOI
4 C. Cretu and E. Lingen, Gold Bulletin, 32, 115 (1999).   DOI
5 K. E. Saeger and J. Rodies, Gold Bulletin, 10, 10 (1977).   DOI
6 J. Emsley, Nature's Building Blocks, Oxford University Press, p168 (2001).
7 H. H. Harris, J. Chem. Educ., 76, 198 (1999).   DOI
8 W. S. Rapson, Gold Bulletin, 23, 125 (1990).   DOI
9 S. Alex and A Dunne, Design Issues, 15, 11 (1999).   DOI
10 C. W. Corti, Platinum Metals Rev., 56, 242 (2003).
11 O. J. Kleppa, J. Phys. Chem., 60, 858 (1956).   DOI
12 Xie, D. J., Y. C. Chan and J. K. L. Lai, IEEE Trans. Compon. Packaging Manuf. Technol. Part B, 19, 148 (1996).   DOI
13 X. F. Ang, G. G. Zhang, J. Wei, Z. Chen and C. C. Wong, Thin Solid Films, 504, 379 (2006).   DOI
14 J. W. Lee and C. S. Kang, J. Korean Inst. Met. Mater., 38, 366 (2000).
15 D. A. Porter, K. E. Easterling and M. Y. Sherif, Phase Transformations in Metals and Alloy, CFC Press, 3rd ed., p96 (2009).
16 E. H. Chung, I. M. Park and Y. H. Park, J. Korean Inst. Met. Mater. 48, 683 (2000).
17 S. Takeuchi, J. Phys. Soc. Jpn., 27, 929 (1969).   DOI
18 J. H. Ahn, K. S. Kim, Y. C. Lee, Y. I. Kim and S. B. Jung, J. Microelectron. Pack. Soc., 17-3, 1 (2010).
19 I. B. MacCormack and J. E. Bowers, Gold Bulletin, 14, 19 (1981).   DOI