Browse > Article
http://dx.doi.org/10.3740/MRSK.2017.27.12.710

Solid-State Synthesis of Yttirum Oxyfluoride Powders and Their Application to Suspension Plasma Spray Coating  

Park, Sang-Jun (Engineering Ceramics Center, Korea Institute of Ceramic Engineering and Technology)
Kim, Hyungsun (School of Materials Engineering, Inha University)
Lee, Sung-Min (Engineering Ceramics Center, Korea Institute of Ceramic Engineering and Technology)
Publication Information
Korean Journal of Materials Research / v.27, no.12, 2017 , pp. 710-715 More about this Journal
Abstract
We synthesized YOF(yttirum oxyfluoride) powders through solid state reactions using $Y_2O_3$ and $YF_3$ as raw materials. The synthesis of crystalline YOF was started at $300^{\circ}C$ and completed at $500^{\circ}C$. The atmosphere during synthesis had a negligible effect on the synthesis of the YOF powder under the investigated temperature range. The particle size distribution of the YOF was nearly identical to that of the mixed $Y_2O_3$ and $YF_3$ powders. When the synthesized YOF powders were used as a raw material for the suspension plasma spray(SPS) coating, the crystalline phases of the coated layer consisted of YOF and $Y_2O_3$, indicating that oxidation or evaporation of YOF powders occurred during the coating process. Based on thermogravimetric analysis, the crystalline formation appeared to be affected by the evaporation of fluoride because of the high vapor pressure of the YOF material.
Keywords
yttrium oxyfluoride; solid-state synthesis; suspension plasma spray;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 M. Schaepkens, R. C. M. Bosch, T. E. F. M. Standaert, G. S. Oehrlein and J. M, J. Cook, Vac Sci. Technol. A, Films, 16, 2099 (1998).
2 Y. Kobayashi, Proc. 37th Seminar on High-Temperature Ceramics. July, p. 1-7 (2005).
3 N. Ito, T. Moriya, F. Uesugi, M. Matsumoto, S. Liu and Y. Kitayama, Jpn J. Appl. Phys., 47, 3630 (2008).   DOI
4 G. S. May and C. J. Spanos, Fundamentals of semiconductor manufacturing and process control., John Wiley & Sons, U.S.A, (2006).
5 A. J. van Roosmalen, J. A. G. Baggerman and S. J. H. Brader, Dry Etching for VLSI., Springer Science & Business Media, Germany (2013).
6 D. M. Kim, Y. S. Oh, S. Kim, H. T. Kim, D. S. Lim and S. M. Lee, Thin Solid Films., 519, 6698 (2011).   DOI
7 J. Iwasawa, R. Nishimizu, M. Tokita, M. Kiyohara and K. Uematsu, J Am. Ceram. Soc., 90, 2327 (2007).   DOI
8 S. J. Kim, J. K. Lee, Y. S. Oh, S. Kim and S. M. Lee, J. Korean Ceram. Soc., 52, 395 (2015).   DOI
9 P. Fauchais and G. Montavon, J. Therm. Spray Tech., 19, 226 (2010).   DOI
10 C. Delbos, J. Fazilleau, V. Rat, J. F. Coudert, P. Fauchais and B. Pateyron, Plasma Chem. Plasma P, 26, 393 (2006).   DOI
11 D. M. Kim, M. R. Jang, Y. S. Oh, S. Kim, S. M. Lee and S. H. Lee, Surf Coat Technol., 309, 694 (2017).   DOI
12 J. K. Lee, S. J. Park, Y. S. Oh, S. Kim, H. Kim and S. M. Lee, Surf. Coat Technol., 309, 456 (2017).   DOI