1 |
P. Poizot, S. Laruelle, S. Grugeon, L. Dupont and J-M. Tarascon, Nature, 407, 496 (2000).
DOI
ScienceOn
|
2 |
A. Azarian, A. Iraji zad, A. Dolati and S. M. Mahdavi, Thin Solid Films, 517, 1736 (2009).
DOI
ScienceOn
|
3 |
F. Zhanga, C. Yuanb, X. Lua, L. Zhanga, Q. Chea and X. Zhag, J. Power Sources, 203, 250 (2012).
DOI
ScienceOn
|
4 |
J. W. Lee, W. S. Choi and H. -C. Shin, Korean J. Mater. Res., 23(12), 680 (2013).
DOI
ScienceOn
|
5 |
R. Sivasubramanian and M. V. Sangaranarayanan, Mater. Chem. Phys., 136, 448 (2012).
DOI
ScienceOn
|
6 |
J. P. Hoare, J. Electrochem. Soc., 133, 2491 (1986).
DOI
|
7 |
S. H Park, H. S. Shin, Y. H. Kim, H. M. Park and J. Y. Song, Nanoscale, 5, 1864 (2013).
DOI
ScienceOn
|
8 |
S. H Park, H. S. Shin, Y. H. Kim, H. M. Park and J. Y. Song, J. Alloys Compd., 580, 152 (2013).
DOI
ScienceOn
|
9 |
C. Wang, D. Wang, Q. Wang and L. Wang, Electrochim. Acta, 55, 6420 (2010).
DOI
ScienceOn
|
10 |
T. Watanabe, Nano-Plating: Microstructure Formation Theory of Plated Films and a Database of Plated Films, 1st ed., Elsevier Science (2004).
|
11 |
M. Nishizawa, K. Mukai, S. Kuwabata, C. R. Martin and H. Yoneyama, J. Electrochem Soc., 144, 1923 (1997).
DOI
ScienceOn
|