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http://dx.doi.org/10.3740/MRSK.2011.21.9.482

Thermal Instability of La0.6Sr0.4MnO3 Thin Films on Fused Silica  

Sun, Ho-Jung (Department of Materials Science and Engineering, Kunsan National University)
Publication Information
Korean Journal of Materials Research / v.21, no.9, 2011 , pp. 482-485 More about this Journal
Abstract
$La_{0.6}Sr_{0.4}MnO_3$ (LSMO) thin films, which are known as colossal magnetoresistance materials, were prepared on fused silica thin films by conventional RF magnetron sputtering, and the interfacial reactions between them were investigated by rapid thermal processing. Various analyses, namely, X-ray diffraction, transmission electron microscopy combined with energy adispersive X-ray spectrometry, and secondary ion mass spectrometry, were performed to explain the mechanism of the interfacial reactions. In the case of an LSMO film annealed at $800^{\circ}C$, the layer distinction against the underplayed $SiO_2$ was well preserved. However, when the annealing temperature was raised to $900^{\circ}C$, interdiffusion and interreaction occurred. Most of the $SiO_2$ and part of the LSMO became amorphous silicate that incorporated La, Sr, and Mn and contained a lot of bubbles. When the annealing temperature was raised to $950^{\circ}C$, the whole stack became an amorphous silicate layer with expanded bubbles. The thermal instability of LSMO on fused silica should be an important consideration when LSMO is integrated into Si-based solid-state devices.
Keywords
$La_{0.6}Sr_{0.4}MnO_3$; fused silica; thin film; interfacial reaction;
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1 J. Miao, X. G. Xu, Y. Jiang, L. X. Cao and B. R. Zhao, Appl. Phys. Lett., 95, 132905 (2009).   DOI   ScienceOn
2 A. Huang, K. Yao and J. Wang, Thin Solid Films, 516, 5057 (2008).   DOI   ScienceOn
3 S. Habouti, R. K. Shiva, C. -H. Solterbeck, M. Es-Souni and V. Zaporojtchenko, J. Appl. Phys., 102, 044113 (2007).   DOI   ScienceOn
4 S. G. Choi, A. S. Reddy, B. -G. Yu, W. S. Yang, S. H. Cheon and H. -H. Park, Thin Solid Films, 518, 4432 (2010).   DOI   ScienceOn
5 P. K. Muduli, G. Singh, R. Sharma and R. C. Budhani, J. Appl. Phys., 105, 113910 (2009).   DOI   ScienceOn
6 Z. J. Wang, H. Usuki, T. Kumagai and H. Kokawa, J. Cryst. Growth, 293, 68 (2006).   DOI   ScienceOn
7 I. -B. Shim, C. -S. Kim, K. -T. Park and Y. -J. Oh, J. Magn. Magn. Mater., 226-230, 1672 (2001).   DOI   ScienceOn
8 Y. -M. Chiang, D. P. Birnie III and W. D. Kingery, Physical Ceramics: Principles for Ceramic Science and Engineering, p. 88, John Wiley & Sons, Inc., USA (1996).
9 Y. -H. Huang, C. -H. Yan, S. Wang, F. Luo, Z. -M. Wang, C. -S. Liao and G. -X. Xu, J. Mater. Chem., 11, 3296 (2001).   DOI   ScienceOn
10 M. B. Salamon and M. Jaime, Rev. Mod. Phys., 73, 583 (2001).   DOI   ScienceOn
11 M. Bibles and A. Barthelemy, IEEE Trans. Electron Dev., 54, 1003 (2007).   DOI   ScienceOn
12 A. -M. Haghiri-Gosnet and J. -P. Renard, J. Phys. Appl. Phys., 36. R127 (2003).   DOI   ScienceOn