1 |
S. Chowdhury, M. Ahmadi, G. A. Jullien, and W. C. Miller, Circuit and Systems, 2002, ISCAS'02, Proceedings of the 2002 Int'l Symp., Vol. 1, 657 (2002)
|
2 |
H.S. Cho, K.J. Hemker, K. Lian, J. Goettert, and G. Dirras, Sensors and Actuators A, 103, 59 (2003)
DOI
ScienceOn
|
3 |
J. Wu and M. G. Pecht, 2004 Int'l IEEE Conf. on Asian Green Electronics, p.127-135 (2005)
|
4 |
T. Itoh, K. Kataoka, and T. Suga, Sensors and Actuators A, 97, 462 (2002)
DOI
ScienceOn
|
5 |
Y. M. Kim, I. S. Yu and J. H. Lee, KIEE Int'l Trans. on EA, 4-C(4), 149-154 (2004)
|
6 |
S. S. Park, J. KIEE, 24(10), p.45-54 (1997)
|
7 |
J. Hormes, J. Gottert, K. Lian, Y. Desta, and L. Jian, Nucl. Instru. Methods Phys. Res. Sect. B, 199, 332 (2003)
DOI
ScienceOn
|
8 |
M. Baghbanan, U. Erb, and G. Palumbo, Phys. Stat. Sol.(a), 203(6), 1259 (2006)
DOI
ScienceOn
|
9 |
M. K. Chen and C.C. Tai, The 4th Int'l Symp. on Electronic Materials and Packaging, IEEE, 4-6 Dec,123 (2002)
|
10 |
K. K. Lee, E. G. Choi, Y. H. Chu, J. S. Kim, B. S. Lee and H K. Ahn, Kor. J. Mater. Res., 18(1), 38-44 (2008)
DOI
ScienceOn
|
11 |
N. Langston, N Langston Jr, and H. Yao, Advanced Packaging, 13(3), 1 (2004)
|
12 |
R. Malucci, IEEE-CHMT, 34(3), 399 (2001)
|
13 |
T. H. Yim, S. C. Yoon and H. S. Kim, Mat. Sci. & Engr A, 449, 836-840 (2007)
DOI
ScienceOn
|
14 |
M. H. Seo, H. S. Hong and W.-S. Jung, J. Mater. Res., 18(3), 117 (2008)
|
15 |
W. Bedyk, M. Niessner, G. Schrag, G. Wachutka, B. Margesin and A. Faes, Sensors and Actuators A, 145, 263 (2008)
DOI
ScienceOn
|
16 |
Dassault Systemes, CATIA Version 5.17, (2006)
|
17 |
ANSYS, Inc., ANSYS(R) Release 11.0, (2005)
|