1 |
A. Ohtomo, M. Kawasaki and T. Koida, Appl, Phys. Lett., 72, 2466 (1998)
DOI
ScienceOn
|
2 |
R. Katouda, Semiconductor Evaluation Technology, Sangyotosyo p. 168 (1989)
|
3 |
D. Jiles, Introduction to the Electronic Preoperties of Materials, Chapman & Hall Publishing, p. 13 (1995)
|
4 |
D. M. Bagnail, Y. F. Chen, Z. Zhu, T. Yao, S. Koyama, M. Y. Shen and T. Goto, Appl. Phys. Lett., 70, 2230 (1997)
DOI
ScienceOn
|
5 |
J. J. Suh, J. Microelectronic & Packaging Soc., 12(1), 73 (2005)
|
6 |
W. I. Park, S. An, G. Yi and H. M. Jang, J. Mater, Res., 16, 1358 (2001)
DOI
ScienceOn
|
7 |
V. Craciun, J. Elders, J. G. E. Gardeniers and I. W. Boyd, Appl. Phys. Lett., 65, 2963 (1994)
DOI
ScienceOn
|
8 |
T. Omata, N. Ueda, K. Ueda and U. Kawazoe, Appl. Phys. Lett., 64, 1077 (1994)
DOI
ScienceOn
|
9 |
Y. S. Park, C. W. Litton, T. C. Collins and D. C. Reynolds, Phys Rev., 143, 512 (1966)
DOI
|
10 |
D. G. Thomas, J. Phys. Chem. Solids, 15, 86 (1960)
DOI
ScienceOn
|
11 |
Z. K. Tang, P. Yu, G. K. L. Wong, M. Kawasaki, A. Ohtomo. H, Koinuma, and Y. Segawa, Solid State Commun., 103, 459 (1997)
DOI
ScienceOn
|
12 |
Y. Chen, D. M. Bangnail, H. Koh, K. Park, K. Hiraga, Z. Zhu and T. Yao, J. Appl. Phys., 84, 3912 (1998)
DOI
ScienceOn
|
13 |
D. C. Reynolds, D. C. Look, B. Jogai, C. W. Litton, G. Cantwell and W. C. Harsch, Phys, Rev., B60, 753 (1999)
DOI
|