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http://dx.doi.org/10.3740/MRSK.2005.15.7.486

The behavior of WO3 Thin Film on NiO Addition  

Kim Gwang-Ho (Department of Materials science and Engineering, Chosun University)
Na Dong-Myong (Department of Materials science and Engineering, Chosun University)
Choi Gwang-Pyo (JAMIC, Sunchun, Jeonnam)
Park Jin-Seong (Department of Materials science and Engineering, Chosun University)
Publication Information
Korean Journal of Materials Research / v.15, no.7, 2005 , pp. 486-490 More about this Journal
Abstract
Thin films of tungsten oxide and nickel oxide were deposited on $Al_2O_3/Si-substrate$ by high vacuum thermal evaporation. The properties of microstructure and crystallinity were analyzed by SEM and XRD respectively. $WO_3$ films without addition of NiO showed polycrystalline structure after annealing at $500^{\circ}C$ for SO min. There were the cracks between the polycrystalline grains and the crack width was increased with the thickness of $WO_3$ films. The cracks in the $WO_3$ films could be controlled by an optimum deposition of NiO on $WO_3$ films and either less or more than the optimum addition fails to suppress the cracks. A process mechanism to suppress the crack has been discussed.
Keywords
Thermal Evaporation; microstructure control;
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