Browse > Article
http://dx.doi.org/10.3740/MRSK.2005.15.3.183

The Effect of Dual Wafer Back-Lapping Process on Flexural Strength of Semiconductor Chips  

Lee Seong Min (Department of Materials Science & Engineering, University of Incheon)
Publication Information
Korean Journal of Materials Research / v.15, no.3, 2005 , pp. 183-188 More about this Journal
Abstract
It was studied in this article how the flexural strength of bare silicon chips is influenced by adopting dual wafer back-lapping process. The experimental results showed that an additional finishing process after the conventional grinding process improves the flexural strength of bare chips by more than 2-fold. In particular, this work showed that the proper removal of the grinding marks$(Ra=0.1\;{\mu}m)$existing on the wafer back-surface resulting from the grinding process significantly contiributes to the enhancement of chip strength.
Keywords
wafer; back-lapping; chip crack; flexural strength;
Citations & Related Records
연도 인용수 순위
  • Reference
1 M. G. Pecht, L. T. Nguyen and E. B. Hakin, PlasticEncapsulated Microelectronics (John Wiley and Sons, Inc., 1995) 242
2 D. Broek, Elementary Engineering Fracture Mechanics, 170 (1983)
3 J.H. Lau, Thermal Stress and Strain in Microelectronics Packaging, 422 (1993)
4 G. Hawkins, H. Berg, M. Mahalingam, G. Lewis, Lofgran, Pro. 25th Int. Reliability Phys. Symp., IEEE, 216 (1987)
5 T.B. Lim, Proc. 25th Int. Reliability Phys. Symp., IEEE, 131 (1989)
6 M. Nishiguchi, N. Goto and H. Nishizawa, IEEE CPMT, 14, 523 (1991)
7 K. Mizuishi, M. Tokuda and Y. Fujita, IEEE CPMT, 11, 447 (1988)
8 R. P. Vidano, D. W. Paananen, T. H. Miers, J. M. Krause-Singh, K. R. Agricola and R. L. Hauser, IEEE CPMT, 12, 612 (1987)
9 M. Nishiguchi N. Goto, T. Sekiguchi, H. Nishizawa, H. Hayashi and K. Ono, IEEE CPMT, 13, 528 (1990)
10 S. M. Lee, S. M. Sim, T. W. Chung, Y. K. Jang and H. K. Cho, JJAP Part 1, 6A, 3374 (1997)   DOI