1 |
J. Prokop, C. E. Zybill, and S. Veprek, Thin Solid Films, 359, 39 (2000)
DOI
ScienceOn
|
2 |
C. Detavernier, R. L. V. Meirhaeghe, and F. Cardon, J. Appl. Phys., 88, 133 (2000)
DOI
ScienceOn
|
3 |
J. Chen, J. P. Colinge, D. Flandre, R. Gillon, J. P. Raskin, and D. Vanhoenacker, J. Electrochem. Soc., 144(7), (1997)
DOI
|
4 |
J. J. Sun, J. Y. Tsai, and C. M. Osburn, IEEE Trans. Electron Devices, 45(9), 1946 (1998)
DOI
ScienceOn
|
5 |
J. Y. Dai, Z. R. Guo, S. F. Tee, C. L. Tay, E. Er, and S. Redkar, Appl. Phys. Lett., 78, 3091 (2001)
DOI
ScienceOn
|
6 |
F. Hong and G. A. Rozgonyi, J.Electrochem. Soc., 141, 3480 (1994)
DOI
|
7 |
C. Y. Kang, D. G. Kang, and J. W. Lee, J. Appl. Phys., 86, 5293 (1999)
DOI
|
8 |
C. M. Osburn, J. Y. Tsai and J. Sun, J. Electron Material, 25, 1725 (1996)
DOI
|
9 |
C. G. Bucher, and U. Bourgund, Structural Safety, 7, 57 (1990)
DOI
ScienceOn
|
10 |
F. Hong, G. A. Rozgonyi, and B. K. Patnaik, Appl. Phys. Lett., 61, 1519 (1992)
DOI
|
11 |
H. Fang, M. C. Oztu, E. G. Seebauer, and D. E. Batchelor, J. Electrochem. Soc., 146, 4240 (1999)
DOI
|
12 |
J. Lutze, G. Scott, and M. Manley, IEEE Electron Device Lett., 21, 155 (2000)
DOI
ScienceOn
|
13 |
A. H. Langner, E. N. Loredo, D. C. Montgomery, A. H. Griffin, Robotics and Computer Integrated Manufacturing, 16, 377 (2000)
DOI
ScienceOn
|