1 |
H. C. Cheng, W. H. Chen, and I. C. Chung, IEEE Trans. Component and Packaging Technologies 27, 359 (2004).
DOI
ScienceOn
|
2 |
K. Y. Hwang, S. B. Rhee, B. Y. Yang, and B. I. Kwon, IEEE Trans. Magn. 43, 1833 (2007).
DOI
ScienceOn
|
3 |
E. Gad and M. Nakhla, IEEE Trans. Advanced Packaging 28, 32 (2005).
DOI
ScienceOn
|
4 |
Y. Zhang, N. K. Nikolova, and M. K. Meshram, IEEE Trans. Antennas and Propagation 60, 3060 (2012).
DOI
ScienceOn
|
5 |
I. Kwak and S. Hahn, IEEE Trans. Magn. 36, 1148 (2000).
DOI
ScienceOn
|
6 |
S. Park and J. Yoo, IEEE Trans. Magn. 48, 3883 (2012).
DOI
ScienceOn
|
7 |
D. G. Krige, Master's thesis, University of Witwatersrand (1951).
|
8 |
J. Sacks, S. B. Schiller, and W. J. Welch, Technometrics 31, 41 (1989).
DOI
ScienceOn
|
9 |
J. Sacks, W. J. Welch, T. J. Mitchell, and H. P. Wynn, Statistical Science 4, 409 (1989).
DOI
ScienceOn
|
10 |
I. Lee, K. K. Choi, and L. Zhao, Struct. Multidisc. Optim. 44, 299 (2011).
DOI
|
11 |
Q. Du, V. Faber and M. Gunzburger, SIAM Review 41, 637 (1999).
DOI
ScienceOn
|
12 |
http://www.ai7.uni-bayreuth.de/test_problem_coll.pdf.
|
13 |
MagNet/ThermNet User's Manual, Infolytica Corporation, Quebec, Canada (2012).
|
14 |
http://www.upmet.com/products/stainless-steel/304304l-ann/physical.
|