Browse > Article
http://dx.doi.org/10.4283/JKMS.2009.19.4.138

Microstructure and Magnetic Properties of Electroplated Ni-Fe Permalloy Thin Films by Saccharin Concentration in Electrolytes  

Lee, Ho-Jun (Department of Physics, Chungnam National University)
Bang, Won-Bae (Department of Physics, Chungnam National University)
Hong, Ki-Min (Department of Physics, Chungnam National University)
Ko, Young-Dong (Department of Physics, Soongsil University)
Chung, Jin-Seok (Department of Physics, Soongsil University)
Lee, Hee-Bok (Department of Physics Education, Kongju National University)
Abstract
We studied the effects of Saccharin on the properties of electroplated Ni-Fe Permalloy thin films. When 0 to 1 ${\mu}mol/L$ of Saccharin was added to the plating electrolyte, the grain sizes of the deposits are found to decrease, which reduces the surface roughness and the coercivity and increases the permeability and magnetoimpedance. The reduction in the grain sizes is strongly correlated with increases in the incremental permeability and the magnetoimpedance. We demonstrated that Saccharine is a useful additive for the electrodeposition of soft Permalloy thin films and that the softness can be adjusted by varying the concentration of Saccharin.
Keywords
electroplating; permalloy; saccharin; additive; magnetoimpedance; permeability; coercivity;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 M.-H. Bao and W.-Y. Wang, Future of Microelectromechanical Systems (MEMS). Sens. Actuators A, 56, 135 (1996).   DOI   ScienceOn
2 P. Ripka, A. Platil, P. Kaspar, A. Tipek, M. Malatek, and L. Kraus, J. Magn. Magn. Mater., 254, 633 (2003).   DOI   ScienceOn
3 Nosang V. Myung, D.-Y. Park, B.-Y. Yoo, and Paulo T. A. Sumodjo, J. Magn. Magn. Mater., 265, 189 (2003).   DOI   ScienceOn
4 H. V. Venkatasetty, J. Electrochem. Soc., 117, 403 (1970).   DOI
5 B. D. Cullity, Introduction to Magnetic Materials (Addison-Wesley, Reading, 1972).
6 R. M. Bozorth, Ferromagnetism, 4th Ed. (Van Norstrand, Princeton, 1956).
7 C. Cheung, G. Palumbo, and U. Erb, Scripta. Metall. et Mater., 31, 735 (1994).   DOI
8 A. Blondel, J. P. Meier, B. Doudin, and J.-Ph. Ansermet, Appl. Phys. Lett., 65(23), 3019 (1994).   DOI   ScienceOn
9 M. Knobel and K. R. Pirota, J. Magn. Magn. Mater., 33, 242 (2002).
10 W. Bang, J. Bae, K. Hong, Y.-D. Ko, J.-S. Chung, and H. Lee, Property Change of Electroplated Permalloy Thin Films by Organic Additives, Journal of the Korean Magnetics Society, 17(3), 133 (2007).   과학기술학회마을   DOI   ScienceOn
11 A. J. Bard and L. R. Faulkner, Electrochemical Methods, Fundamentals and Applications (Wiley, New York, 2001).
12 G. Herzer, IEEE Trans. Magn., 26, 1397 (1990).   DOI   ScienceOn
13 M. J. Aus, B. Szpunar, A. M. El-Sherik, U. Erb, G. Palumbo, and K. T. Aust, Scripta. Metall. et Mater., 27, 1639 (1992).   DOI   ScienceOn
14 H. L. Seet, X. P. Li, Z. J. Zhao, Y. K. Kong, H. M. Zheng, and W. C. Ng, J. Appl. Phys., 97, 10N304 (2005).   DOI
15 S.-H. Kim, T. Kang, H.-J. Sohn, Y.-C. Joo, Y.-W. Kim, T.-H. Yim, and H.-Y. Lee, Magnetic Materials, Process, and Devices VII and Electrodeposition of Alloys (Ed. S. Krongelb, The Electrochemical Society, Pennington, 2003).