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http://dx.doi.org/10.4283/JKMS.2007.17.3.141

A New LC Resonator Fabricated by MEMS Technique and its Application to Magnetic Sensor Device  

Kim, Bong-Soo (Department of Physics Education, Kongju National University)
Kim, Yong-Seok (Department of Physics Education, Kongju National University)
Hwang, Myung-Joo (Department of Physics Education, Kongju National University)
Lee, Hee-Bok (Department of Physics Education, Kongju National University)
Abstract
A new class of LC-resonator for micro magnetic sensor device was invented and fabricated by means of MEMS technique. The micro LC-resonator consists of a solenoidal micro-inductor with a bundle of soft magnetic microwire cores and a capacitor connected in parallel to the micro-inductor. The core magnetic material is a tiny glass coated $Co_{83.2}B_{3.3}Si_{5.9}Mn_{7.6}$ microwire fabricated by a glasscoated melt spinning technique. The core materials were annealed at various temperatures $150^{\circ}C,\;200^{\circ}C\;,250^{\circ}C\;,$ and $300^{\circ}C$ for 1 hour in a vacuum to improve soft magnetic properties. The solenoidal micro-inductors fabricated by MEMS technique were $500{\sim}1,000{\mu}m$ in length with $10{\sim}20$ turns. The changes of inductance as a function of external magnetic field in micro-inductors with properly annealed microwire cores were varied as much as 370%. Since the permeability of ultra soft magnetic microwire is changing rapidly as a function of external magnetic field. The inductance ratio as well as magnetoimpedance ratio (MIR) in a LC-resonator was varied drastically as a function of external magnetic field. The MIR curves can be tuned very precisely to obtain maximum sensitivity. A prototype magnetic sensor device consisting of the developed microinductors with a multivibrator circuit was test successfully.
Keywords
MEMS; microinductor; magnetoimpedance; microwires; LC resonator; magnetic sensors;
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  • Reference
1 G. T. A. Kovacs, 'Micromachined Transducers Sourcebook', McGraw-Hill Companies, 1st Edition (1998)
2 C. Hierold, Proc. IEEE MEMS 2000, 1-6 (2000)
3 K. Y. Lee, N. Labianca, S. A. Rishton, S. Zolgharnain, J. D. Gelorme, J. Shaw, and T. H.-P. Chang, J. Vac. Sci. Technol. B, 13(6), 3012 (1995)
4 Y. E. Chen, Y. K. Yoon, J. Laskar, and Mark Allen, IEEE MTT-S Digest, (2001) 523
5 H. Lu, B. Pillans, J.-C. Lee, K. Kim, and J.-B. Lee, Microsystem Technologies, 13(3-4), 409 (2007)   DOI   ScienceOn
6 H. Lee, Y. K. Kim, T. K. Kim, Y. H. Song, and S. C. Yu, J. Appl. Phys., 85(8), 5429 (1999)   DOI   ScienceOn