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Nonhermetic Plastic Packaged Optical Modules of Passive Optical Fiber Alignment Method  

Lim, Dong-Cheol (인하대학교 전자공학과)
Lee, Won-Jong (인하대학교 전자공학과)
Kang, Suk-Youb (한국해양대학교 전파공학과)
Park, Hyo-Dal (인하대학교 전자공학과)
Abstract
In this paper, We proposed a efficient OSA(Optical Sub-Assembly) packaging method in use 1.31/1.49um bi-directional hybrid-integrated PLC chip for low-cost OSA in optical access network system applications as GE-PON in FTTH. Fabricated OSA with passive optical fiber alignment and nonhermetic plastic package method and measured optical coupling efficiency and electric-optical characteristics. Its performance is feasible to satisfy the GE-PON ONU specifications with the results as less than 0.5dB coupling losses within 40um alignment of z-axis and less than -24dBm sensitivity. It also has good temperature characteristics to sustain optical output power more than 1.5mW and 10dB extinction ratio, less than 0.3dB tracking error.
Keywords
FTTH; GE-PON; OSA; Passive Alignment; Nonhermetic;
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