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http://dx.doi.org/10.7317/pk.2012.36.4.407

Characteristics of Nylon6/Ionomer Semi IPN for Molded-In-Color Compound  

Lee, Ja-Hun (Center for Photofunctional Energy Materials, Dept. of Polymer Sci. and Eng., Dankook University)
Hwang, Jin-Taek (Mando Advanced Materials)
Kang, Ho-Jong (Center for Photofunctional Energy Materials, Dept. of Polymer Sci. and Eng., Dankook University)
Publication Information
Polymer(Korea) / v.36, no.4, 2012 , pp. 407-412 More about this Journal
Abstract
The characteristics of nylon6/ionomer semi interpenetrating networks (IPN) as a molded-in-color (MIC) compound had been studied, and comparison was made with nylon6/ionomer blends. Nylon6/ionomer semi IPN shows better homogeneity in phase morphology than nylon6/ionomer blend, and it caused better anti-scratching performance than the blend. This semi IPN structure resulted in lowered crystallization rate, increased melt viscosity and less temperature dependency of viscosity. As a result, we may expect the enhancement of melt processing characteristics in an injection molding process using nylon6/ionomer semi IPN as a MIC compound.
Keywords
molded-in-color compound; nylon6; ionomer; interpenetrating network; anti-scratching;
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  • Reference
1 S. C. Feinberg, U. S. Patent 6,756,443 B2 (2004).
2 C. J. Talkowski, U. S. Patent 5,866,658 (1999).
3 S. C. Feinberg, C. J. Talkowski, and K. C. Andersen, U. S. Patent 7,144,938 B1 (2006).
4 C. W. Lin, Y. F. Huang, and A. M. Kannan, J. Power Sources, 164, 449 (2007).   DOI   ScienceOn
5 D. L. Siegfried, D. A. Thomas, and L. H. Sperline, U. S. Patent 4,468,499 (1984).
6 D. Klempner, L. H. Sperling, and L. A. Utracki, Interpenetrating Polymer Networks, American Chemical Society, 1994.
7 T. Hong, J. Hwang, and H. Kim, Korea Patent 0081493 (2010).
8 T. Hong, J. Hwang, and H. Kim, Korea Patent 0049345 (2010).
9 T. Hong, J. Hwang, and H. Kim, Korea Patent 0049362 (2010).
10 T. Hong, J. Hwang, and H. Kim, Korea Patent 0049347 (2010)
11 X. F. Lu and J. H. Hay, Polymer, 42, 9423 (2001).   DOI   ScienceOn
12 M. Joshi, B. S. Butola, G. Simon, and N. KuKaleva, Macromolecules, 39, 1839 (2006).   DOI   ScienceOn
13 K. C. Cho, B. H. Lee, K. M, Hwang, H. S. Lee, and S. J. Lee, Polym. Eng. Sci., 38, 1969 (1998).   DOI   ScienceOn
14 K. S. Cole and R. H. Cole, J. Chem. Phys., 9, 341 (1941).   DOI
15 M. Toshiki and O. Kazuhisa, Japanese Patent 255842 (1990).
16 K. Ogiso and H. Mukai, U. S. Patent 5,800,912 (1998).
17 Y. Kazuhisa, K. Daisuke, and K. Akihikoc, Japanese Patent 308441 (1989).
18 S. Kuniyuki, K. Matsuji, N. Masakazu, and M. Masamichi, Japanese Patent 301748 (1989).
19 R. P. Saltman, U. S. Patent 5,091,478 (1992).