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Characterizations of Adhesion Property, Morphology and Cure Reaction of Epoxy/Polyamide/MPD Reactive Blend with Imidazole(2E4MZ-CN) Catalyst  

Song, Hyun-Woo (Department of Chemical Engineering, Pusan National University)
Kang, Hak-Su (Department of Chemical Engineering, Pusan National University)
Kim, Won-Ho (Department of Chemical Engineering, Pusan National University)
Marzi, Stephan (LS-DYNA Simulations Group, Fraunhofer-IFAM)
Kim, Byung-Min (Department of Mechanical Engineering, Pusan National University)
Choe, Young-Son (Department of Chemical Engineering, Pusan National University)
Publication Information
Polymer(Korea) / v.33, no.4, 2009 , pp. 290-296 More about this Journal
Abstract
The morphology and mechanical properties of epoxy/polyamide/MPD/2E4MZ-CN reactive blends with various amount of catalyst were investigated. The cure behaviors, mechanical strengths, and morphological changes of the epoxy blend systems were analyzed by using DSC, UTM, and SEM, respectively. The amount of catalyst ranged from 0 to 3 phr, and the cure reaction occurred at $170^{\circ}C$ for 30 min. The maximum peaks in heat flow during cure reactions appeared at slightly lower temperature with increasing catalyst content, indicating that the cure reactions start at lower temperature by adding catalyst and polyamide rarely hinders the cure reaction paths. The co-continuous morphology was found in epoxy/polyamide(20 phr) blends and by adding catalyst to the blends much clearer and uniform co-continuous phase was observed. The surface tension of the mechanical test specimen was increased due to the AP plasma surface treatment, and then adhesion strength was increased by over 20% by adding 2 phr of catalyst to the blends. When considering morphological tuning of the blends by means of catalyst incorporation, it is expected that the increased elongation and adhesion strength can be achieved in the structural adhesive systems.
Keywords
epoxy; polyamide; AP plasma treatment; structural adhesive; morphology;
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1 D. Lahlali, M. Naffakh, and M. Dumon, Polym. Eng. Sci., 45, 1581 (2005)   DOI   ScienceOn
2 S. G. Prologo, T. Fine, and J. P. Pascault, J. Appl. Polym. Sci., 93, 2678 (2004)   DOI   ScienceOn
3 A. Bonnet, J. P. Pascault, H. Sautereau, M. Taha, and Y. Camberlin, Macromolecules, 32, 8517 (1999)   DOI   ScienceOn
4 R. W. Venderbosch, H. E. H. Meijer, and P. J. Lemstra, Polymer, 36, 1167 (1995)   DOI   ScienceOn
5 Y. C Chen and W. Y. Chiu, Polymer, 42, 5439 (2001)   DOI   ScienceOn
6 M. D. Green, F. J. Guild, and R. D. Adams, Int. J. Adhes. Adhes., 81, 22 (2002)
7 M. Y. Kim, W. H. Kim, Y. Choe, J. M. Park, and I. S. Park, Polym. Int., 51, 1353 (2002)   DOI   ScienceOn
8 B. S. Kim, T. China, and T. Inoue, Polymer, 36, 43 (1995)   DOI   ScienceOn
9 M. Noeske, J. Degenhardt, S. Strudthoff, and U. Lommatzsch, Int. J. Adhes. Adhes., 24, 171 (2004)   DOI   ScienceOn
10 S. G. Prologo, M. Buron, and J. Rodriquez, J. Therm. Anal. Cal., 87, 269 (2007)   DOI   ScienceOn
11 Tang, O. J. Kwon, N. Lu, and H. S. Choi, Sur. Coat. Technol., 195, 298 (2005)   DOI   ScienceOn
12 D. G. Kim, S. Y. Park, and C. R. Park, Polymer(Korea), 24, 58 (2000)   과학기술학회마을
13 B. S. Kim, D. S. Lee, and S. W. Hyun, J. Ind. Eng. Chem., 7, 449 (2001)   ScienceOn
14 Y. Choe and W. H. Kim, Macromol. Res., 10, 259 (2002)   DOI   ScienceOn
15 ASTM D1002 edition, ASTM International (2005)
16 C. C. Su, E. M. Woo, and Y. P. Huang, Polym. Eng. Sci., 45, 1 (2005)   DOI   ScienceOn
17 S. K. Ooi, W. D. Cook, G. P. Simon, and C. H. Such, Polymer, 41, 3639 (2000)   DOI   ScienceOn
18 S. G. Prologo and M. G. Prologon, J. Therm. Anal. Cal., 87, 259 (2007)   DOI   ScienceOn
19 D. S. Kim, J. K. Lee, and E. J. Choi, Polymer(Korea), 23, 569 (1999)
20 C. B. Bucknall, C. M. Gomez, and I. Quitard, Polymer, 35, 353 (1994)   DOI   ScienceOn
21 J. P. Pascault, H. Sautereau, J. Verdu, and R. J. J. Williams, Thermosetting Polymers, Plastics Engineering Series/64, Marcel-Dekker Inc., New York, p 226 (2002)
22 C. Arribas, R. M. Masegosa, C. Salom, E. Arévalo, S. G. Prolongo, and M. G. Prolongo, J. Therm. Anal. Cal., 86, 693 (2006)   DOI   ScienceOn
23 C. B. Bucknall and I. K. Partridge, Polymer, 24, 639 (1983)   DOI   ScienceOn
24 S. D. Lee, B. H. An, K. K. Lee, and W. H. Kim, J. Korean Ind. Eng. Chem. 5, 640 (2004)
25 S. J. Kim, K. Y. Huh, J. R. Lee, Y. T. Hong, and K. Y. Choi, Polymer(Korea), 26, 599 (2002)   과학기술학회마을
26 W. H. Kim, Y. Choe, D. H. Kim, M. Y. Kim, and S. C. Hwang, J. Chem. Eng. Japan, 38, 623 (2005)   DOI   ScienceOn
27 R. W. Venderbosch, H. E. H. Meijer, and P. J. Lemstra, Polymer, 35, 4349 (1994)   DOI   ScienceOn
28 J. M. Barton, l. Hamerton, B. J. Howlin, J. R. Jones, and S. Liu, Polymer, 30, 1929 (1998)
29 S. H. Park, T. V. Phuong, H. W. Song, K. N. Park, B. M. Kim, and Y. Choe, J. Korean Ind. Eng. Chem., 19, 471 (2008)
30 H. W. Song, K. N. Park, S. H. Park, H. S. Kang, T. V. Phuong, T. N. Nguyen, S. K. Natarajan, W. H. Kim, B. M. Kim, and Y. Choe, Polymer(Korea), submitted
31 E. Liston, L. Martinu, and M. R. Wertheimer, J. Adhes. Sci. Technol., 7, 1091 (1993)   DOI   ScienceOn
32 W. H. Kim, Y. Choe, J. O. Beak, and D. H. Kim, Krean. J. Chem. Eng., 22, 755 (2005)   DOI   ScienceOn
33 Y. C. Kim, S. J. Park, and J. R. Lee, J. Korean Ind. Eng. Chem., 8, 960 (1997)
34 S. D. Lee, B. H. Ahn, K. G. Lee, and W. H. Kim, J. Korean Ind. Eng. Chem., 15, 646 (2004)
35 Z. Zhong and Q. Guo, Polymer, 39, 3451 (1998)   DOI   ScienceOn