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The Peel Energy Behavior of UV-Cured Acrylic PSAs  

Son, Hee-Chul (Department of Polymer Science, Kyungpook National University)
Kim, Ho-Gyum (Department of Polymer Science, Kyungpook National University)
Lee, Dong-Ho (Department of Polymer Science, Kyungpook National University)
Min, Kyung-Eun (Department of Polymer Science, Kyungpook National University)
Publication Information
Polymer(Korea) / v.32, no.4, 2008 , pp. 313-321 More about this Journal
Abstract
Acrylic pressure sensitive adhesive(PSA) was prepared by UV radiation curing and the peel energy and physical properties of PSA were investigated. The increase of amount of acrylic acid leads to improve the peel energy, associated with the substrate having smooth surface and high layer thickness. The high peel energy is obtained when the direction of irregularity in substrate is horizontal with the peeling direction. This is attributed to the increase of resistance to peeling in spite of decrease of wetting and the result corresponds to our supposition.
Keywords
PSA; acrylic; surface energy; peel; roughness;
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1 A. Pizzi and K. L. Mittal, Adhesive Technology and Application, Marcel Dekker, New York, 2003
2 A. J. Kinloch, Adhesion and Adhesives, Science and Technology, Lausanne, 1986
3 Alphonsus V. Pocius, Adhesion and Adhesives Tech-nology, Carl Hanser Verlag, Munich, 2002
4 J. H. Hong, UV Radiation Curing, Chosun University Press, 2002
5 Z. Czech, Int. J. Adhes. Adhes., 24, 503 (2004)   DOI   ScienceOn
6 Y.-Y. Wang, C.-J. Li, and A. Ohmori, Thin Solid Films, 485, 141 (2005)   DOI
7 M. Shahid and S. A. Hashim, Int. J. Adhes. Adhes., 22, 235 (2002)   DOI   ScienceOn
8 A. F. Harris and A. Beevers, Int. J. Adhes. Adhes., 19, 445 (1999)   DOI   ScienceOn
9 T. Sekercioglu et al., Journal of Materials Processing Technology, 142, 82 (2003)   DOI   ScienceOn
10 J. P. Sargent, Int. J. Adhes. Adhes., 26, 151 (2006)   DOI   ScienceOn
11 Posco Catalogue, Stainless, Pohang, 2001
12 F. M. Fowkes, Ind. Eng. Chem., 56, 40 (1964)
13 N. Morel, Ph. Tordjeman, J. Duwattez, and E. Papon, Journal of Colloid and Interface Science, 280, 374 (2004)   DOI   ScienceOn
14 A. N. Gent and J. Schultz, J. Adhes., 3, 281 (1972)   DOI   ScienceOn
15 Polymer Science & Technology, 6, 545 (1995)
16 P. Tordjeman, E. Papon, and J-J. Villenave, J. Chem. Phys., 113, 10712 (2000)   DOI   ScienceOn
17 D. H. Kaelble and K. C. Uy, J. Adhes., 2, 50 (1970)   DOI
18 M. F. Tse, J. Adhes. Sci. Technol., 3, 551 (1989)   DOI
19 D. E. Packham, Handbook of Adhesion, 2nd edition, John Wiley & Sons, Ltd, New York, 2005
20 D. K. Owens and R. C. Wendt, J. Appl. Polym. Sci., 13, 1741 (1969)   DOI
21 D. K. Owens and R. C. Wendt, J. Appl. Polym. Sci., 13, 1740 (1969)
22 D. G. Lee, S. Kim, and I. Yong-Taek, J. Adhes., 35, 39 (1991)   DOI   ScienceOn
23 P. Tordjeman and E. Papon, J. Appl. Polym. Sci., 38, 1201 (2000)   DOI   ScienceOn
24 A. Chiche et al., C. R. Acad. Sci. Paris, t. 1, Serie IV, p.1197 (2000)
25 A. N. Gent and J. Schultz, Proc. 162nd ACS Meeting, 31, 113 (1971)
26 Junko Asahara and Naruhito Hori, J. Appl. Polym. Sci., 87, 1493 (2003)   DOI   ScienceOn
27 J. W. Kwon and D. G. Lee, J. Adhes. Sci. Technol., 14, 1085 (2000)   DOI   ScienceOn
28 Z. Czech, J. Appl. Polym. Sci., 81, 3212 (2001)   DOI   ScienceOn
29 A. Aymonier and D. Leclercq, J. Appl. Polym. Sci., 89, 2749 (2003)   DOI   ScienceOn
30 O. Ben-Zion and A. Nussinovitch, J. Adehsion Sci. Technol., 16, 599 (2002)   DOI   ScienceOn
31 W. H. Yang, J. Appl. Polym. Sci., 55, 64 (1995)
32 A. Dupre, Theorie Mecanique de la Chaleur, Gauthier-Villars, Paris, p. 369 (1869)
33 D. Satas, Handbook of Pressure Sensitive Adhesive Technology, 2nd edition, Van Nostrand Reinhold, New York, 1989
34 Istvan Benedek, Pressure-Sensitive Adhesives and Applications, 2nd edition, Marcel Dekker, New York, 2004