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Preparation and Thermal Conductivity of Poly(organosiloxane) Rubber Composite with Low Hardness  

Kang Doo Whan (Hyperstructured Organic Materials Research Center, Department of Polymer Science & Engineering, Dankook University)
Yeo Hak Gue (Hyperstructured Organic Materials Research Center, Department of Polymer Science & Engineering, Dankook University)
Publication Information
Polymer(Korea) / v.29, no.2, 2005 , pp. 161-165 More about this Journal
Abstract
$\alpha,\omega-Vinyl$ poly(dimethyl-methylphenyl) siloxane propelymer (VPMPS ) was prepared by the equilibrium polymerization of octamethylcyclotetrasiloxane $(D_4)$, 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane $(D_3^{MePh})$, and 1,1,3,3-tetramethyl-1,3-divinylsiloxane (MVS) as end-blocker. And also, $\alpha,\omega-hydrogen$ poly(dimethyl-methyltrifluoropropyl)siloxane prepolymer (HPDMFS) was prepared from $D_4$, 1,3,5-trimethyl-1,3.5-trifluoropropylcyclotrisiloxane $(D_3^{MeF3P})$, and 1,1,3,3-tetramethyldisiloxane. Poly(organosiloxane) rubber composite containing high thermal conductive filler was prepared by compounding VPMPS, HPDMFS, spherical alumina, and catalyst in high speed dissolver. The crosslinking density of poly (organosiloxane) composite was measured by oscillation rheometer. Poly(organosiloxane) composites of TC-POXR-2 and TC-POXR-4 prepared by controlling average diameters of thermal conductive filler, spherical alumina according to Horsfield's packing model were shown to 1.13 W/mK for TC-POXR-2 and 1.19 W/mK for TC-POXR-4.
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