Browse > Article

A Study on the PTC Thermistor Characteristics of Polyethylene and Polyethylene Copolymer Composite Systems in Melt and Solution Manufacturing Method  

김재철 (성균관대학교 고분자공학과)
박기헌 (성균관대학교 전기ㆍ전자ㆍ컴퓨터공학과)
남재도 (성균관대학교 고분자공학과)
Publication Information
Polymer(Korea) / v.26, no.6, 2002 , pp. 812-820 More about this Journal
Abstract
The positive temperature coefficient (PTC) characteristics of polymer composites were investigated with the nano-sized carbon black particles using solution tasting and melt compounding methods. The polymeric PTC composites should the electrical threshold at 35 wt% for the melt compounding method and 40 wt% for the solution casting method. The ethylene vinylacetate copolymer (EVA) composite showed a gradual increase of resistance as a function of temperature and showed a maximum at the polymer molting point. The resistance of the high-density polythylene (HDPE) composite remains unchanged with temperature but started to Increase sharply near the melting point of HDPE and showed a maximum resistance at the melting point of HDPE. The dispersion of nano-sized carbon black particles was investigated by scanning electron microscopy (SEM) and low resistance after electrical threshold, and both methods exhibited a well dispersed morphology. When the electric current was applied to the PTC composites, the resistance started increasing at the curie temperature and further increased until the trip temperature was roached. Then the resistance remained stable over the trip temperature. The secondary increase started at T$\sub$m/ of matrix polymer and kept increasing up to the trip temperature.
Keywords
positive temperature coefficient (PTC); nano-sized carbon black; electrical resistance; dispersity; curie temperature;
Citations & Related Records

Times Cited By Web Of Science : 1  (Related Records In Web of Science)
Times Cited By SCOPUS : 0
연도 인용수 순위
  • Reference
1 /
[ D. J. Wang;J. Qiu;Z. L. Gui;L. T. Li ] / J. Mater. Res.   DOI
2 /
[ G. Yu;M. Q. Zhang;H. M. Zeng;Y. H. Hou;H. B. Zhang ] / J. Appl. Polym. Sci.   DOI   ScienceOn
3 /
[ G. Wu;C. Zhang;T. Miura;S. Asai;M. Sumita ] / J. Appl. Polym. Sci.   DOI   ScienceOn
4 /
[ J. C. Lee;K. N. Ajima;T. Ikehara;T. Nishi ] / J. Appl. Polym. Sci.
5 /
[ M. H. Bischoff, Franc;O. E. Dolle ] / Carbon   DOI   ScienceOn
6 /
[ R. Strumpler;J. Skindhφj;J. G. Reichenbach;J. H. W. Kuhlefelt;F. Perdoncin ] / Transaction on Power Delivery   DOI   ScienceOn
7 /
[ S. J. Lee;J. D. Nam;S. J. Suh;J. W. Yoon ] / Korea Patent 10-2001-0027981
8 New PTC and NTC Thick Film Materials for Gigahertz Range Temperature Variable Attenuators /
[ A. H. Feingold;P. Amstutz;R. L. Wahlers;C. Huang;S. J. Stein ] / IEMT/IMC Proceeding
9 /
[ G. Boiteux;J. Fournier;D. Issotier;G. Seytre;G. Marichy ] / Synthetic Metals   DOI   ScienceOn
10 /
[ B. J. Coleman;R. D. Sanner;E. J. Severin;R. H. Grubbs;N. S. Lewis ] / Anal. Chem.   DOI   ScienceOn
11 /
[ X. S. Yi;G. Wu;Y. Pan ] / Polym. Int.   DOI   ScienceOn
12 /
[ Y. W. Liu;K. Oshima;T. Yamauchi;M. Shimomura;S. Miyauchi ] / Synthetic Metals   DOI
13 /
[ R. Strumpler;G. Maidorn;J. Rhyner ] / J. Appl. Phys.   DOI   ScienceOn
14 /
[ O. Breuer;R. Tchoudakov;M. Nakkis;A. Siegmann ] / J. Appl. Polym. Sci.
15 /
[ F. A. Doljack ] / Transactions on Components, Hybrids and Manufacturing Technology
16 /
[ D. J. Wang;J. Qiu;Y. C. Guo;Z. L. Gui;L. T. Li ] / J. Mater. Res.   DOI   ScienceOn
17 /
[ K. T. Chung;A. Sabo;A. P. Pica ] / J. Appl. Phys.   DOI
18 /
[ T. J. Hall ] / U. S. Patent 6,059,997
19 /
[ R. D. Ford;I. M. Vitkovitsky ] / Transaction on Electrical Insulating   DOI
20 /
[ Y. Liu;K. Oshima;T. Yamauchi;M. Shimomura;S. Miyauchi ] / J. Appl. Polym. Sci.   DOI   ScienceOn
21 /
[ J. Meyer ] / Polym. Eng. Sci.   DOI
22 /
[ A. Ueno;S. Sugaya ] / Electronics and Communications in Japan
23 /
[ J. Feng;C. M. Chan ] / Polymer   DOI   ScienceOn
24 /
[ X. Zhang;Y. Pan;L. Shen;X. Yi ] / J. Appl. Polym. Sci.   DOI   ScienceOn
25 /
[ H. Zois;L. Apekis;M. Omastova ] / Macromol. Symp.   DOI   ScienceOn
26 /
[ M. Harpaz;M. Narkis ] / J. Polym. Sci., Part B: Polym. Phys   DOI   ScienceOn
27 /
[ S. Lue;C. P. Wong ] / International Symposium on Advanced Packaging Materials
28 /
[ X. S. Yi;G. Wu;D. Ma ] / J. Appl. Polym. Sci.   DOI   ScienceOn
29 /
[ S. Lue;C. P. Wong ] / Transactions on Components and Packaging Technologies   DOI   ScienceOn
30 /
[ X. S. Yi;L. Shen;Y. Pan ] / Composities Science and Technology   DOI   ScienceOn
31 /
[ K. T. Chung;A. Sabo;A. P. Pica ] / J. Appl. Phys.   DOI
32 /
[ S. J. Lee;J. D. Nam;S. J. Suh ] / Korea Patent 20-2001-0011056