1 |
T. Makabe and T. Yakisawa, Mater. Sci. Forum 555, 65-71 (2007).
DOI
|
2 |
Z. Hua-Yu and M. Zong-Xin, Chinese Phys. B 17, 1475-1479 (2008).
DOI
|
3 |
V. K. Decyk and T. V. Singh, Comput. Phys. Comm. 185, 708-719 (2014).
DOI
|
4 |
C. K. Birdsall and A. b. Langdon, Plasma Physics vis Computer Simulation, Taylor & Francis Group (2005).
|
5 |
V. Vahedi and M. Surendra, Comput. Phys. Comm. 87, 179-198 (1995).
DOI
|
6 |
P. Sigmund, Phys. Rev. 184, 383-416 (1969).
DOI
|
7 |
M. P. Seah and T. S. Nunney, J. Phys. D: Appl. Phys. 43, 253001 (2010).
DOI
|
8 |
R. Behrisch and W. Eckstein, Sputtering by particle Bombardment, Springer (2007).
|
9 |
Y. Yamamura and H. Tawara, Atom. Data Nucl. Data 62, 149-253 (1996).
DOI
|
10 |
V. Vahedi and G. DiPeso, J. Comput. Phys. 131, 149-163 (1997).
DOI
|
11 |
S. Kuroiwa, T. Mine, T. Yakisawa and T. Makabe, J. Vac. Sci. Technol. B 23, 2218-2221 (2005).
DOI
|
12 |
I. Kolev and A. Bogaerts, IEEE T. Plasma Sci. 34, 886-894 (2006)
DOI
|
13 |
P. J. Kelly and R. D. Arnell, Vaccum 56, 159-172 (2000).
DOI
|
14 |
W. Gao, Z. Li, Ceram. Int. 30, 1155-1159 (2004).
DOI
|
15 |
K. Sarakinos, J. Alami, and S. Konstantinidis, Surf. Coat. Tech. 204, 1661-1684 (2010).
DOI
|
16 |
K. Ellmer and T. Welzel, J. Mater. Res. 27, 765-779 (2012).
DOI
|
17 |
S. H. Jeong and J. H. Boo, Thin Solid Films 447-448, 105-110 (2004).
|
18 |
S. Mraz and J. M. Schneider, J. Appl. Phys. 100, 023503 (2006).
DOI
|
19 |
M.-J. Keum and J.-H. Han J. Korean Phys. Soc. 53, 1580-1583 (2008).
DOI
|
20 |
H. C. Nguyen, T. T. Trinh, T. Le, C. V. Tran, T. Tran, H. Park, V. A. Dao, and J. Yi, Semicond. Sci. Technol. 26, 105022 (2011).
DOI
|
21 |
J. P. Verboncoeur, Plasma, Phys. Controlled Fusion 47, A231 (2005).
DOI
|
22 |
C. H. Shon and J. K. Lee, Appl. Surf. Sci. 192, 258-269 (2002).
DOI
|
23 |
C. H. Shon, J. K. Lee, H. J. Lee, Y. Yang, and T. H. Chung, IEEE T. Plasma Sci. 26, 1635-1644 (1998).
DOI
|