1 |
H. Okubo, N. Hayakawa, and G. C. Montanari, IEEE Trans. Dielectr. Electr. Insul., 14, 1516 (2007). [10.1109/TDEI.2007.4401236]
DOI
|
2 |
H. Kikuchi and H. Hanawa, IEEE Trans. Dielectr. Electr. Insul., 19, 99 (2012). [10.1109/TDEI.2012.6148507]
DOI
|
3 |
Y. Kikuchi, T. Murata, Y. Uozumi, N. Fukumoto, M. Nagata, Y. Wakimoto, and T. Yoshimitsu, IEEE Trans. Dielectr. Electr. Insul., 15, 1617 (2008). [DOI: http://dx.doi.org/10.1109/TDEI.2008.4712665]
DOI
|
4 |
P. Preetha and M. J. Thomas, IEEE Trans. Dielectr. Electr. Insul., 18, 264 (2011). [10.1109/TDEI.2011.5704518]
DOI
|
5 |
P. Preetha and M. J. Thomas, IEEE Trans. Dielectr. Electr. Insul., 18, 264 (2011). [10.1109/TDEI.2011.5704518]
DOI
|
6 |
M. Hoof and S. Lanz, IEEE Electr. Insul. Conf. and Electrical Manufacturing and Coil Winding Conf. (Cincinnati, USA, 1999) p.195-200.
|
7 |
M. Kaufhold, G. Borner, M. Eberhardt, and J. Speck, IEEE Electr. Insul. Mag., 12, 9 (1996). [DOI: http://dx.doi.org/10.1109/57.537190]
DOI
|
8 |
M. Kaufhold, H. Auinger, M. Berth, J. Speck, and M. Eberhardt, IEEE Trans. Industr. Electronics, 2, 396 (2000). [DOI: http://dx.doi.org/10.1109/41.836355]
DOI
|
9 |
S. R. Chalise, S. Grzybowski, and C. D. Taylor, Proc. of IEEE Electrical Ship Technologies Symposium (Baltimore, USA, 2009) p.533.
|
10 |
S. Grzybowski, E. A. Feilat, and P. Knight, Proc. of the 12th International Symposium on High Voltage Engineering (Bangalore, India, 2001) p. 521.
|
11 |
N. Hayakawa and H. Okubo, IEEE Electrical Insulation Magazine, 24, 22 (2008). [10.1109/MEI.2008.4473051]
DOI
|
12 |
E. Ildstad and S. R. Chalise, Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 85 (2009).
|
13 |
G. C. Stone, I. Culbert, E. A. Boulter, and H. Dhirani, IEEE Press Series on Power Engineering (2004).
|
14 |
T. D. Chu, High Frequency Breakdown Voltage, IEEE Paper, SSCL-539 (1992).
|
15 |
E. Sugimoto, IEEE Electrical Insulation Magazine, 5, 15 (1989). [10.1109/57.16949]
DOI
|
16 |
J. J. Park, Y. B. Park, and J. Y. Lee, Trans. Electr. Electron. Mater., 12, 93 (2011). [http://dx.doi.org/10.4313/TEEM.2011.12.3.93]
DOI
|