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http://dx.doi.org/10.4313/TEEM.2015.16.3.107

Numerical Modeling of Charge Transport in Polymer Materials Under DC Continuous Electrical Stress  

Hamed, Boukhari (Laboratoire de developpement des materiaux semi-conducteur et materiaux dielectrique, Departement de Genie Electrique, Universite Amar Tlidji)
Fatiha, Rogti (Laboratoire de developpement des materiaux semi-conducteur et materiaux dielectrique, Departement de Genie Electrique, Universite Amar Tlidji)
Publication Information
Transactions on Electrical and Electronic Materials / v.16, no.3, 2015 , pp. 107-111 More about this Journal
Abstract
Our work is based on the development of a numerical model to develop a methodology for predicting the aging and breakdown in insulation due to the dynamics of space charge packets. The model of bipolar charge transports is proposed to simulate space charge dynamic for high DC voltage in law-density polyethylene (LDPE), taking into account the trapping and detrapping of recombination phenomena, this model has been developed and experimentally validation. Theoretical formulation of the physical problem is based on the Poisson, the continuity and the transport equations as well as on the appropriate models for injection. Numerical results provide temporal and local distributions of the electric field, the space charge density for the different kinds of charges, conduction and displacement current densities, and the external current.
Keywords
Bipolar transport model; Polyethylene; Space charge packets; DC voltage;
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1 F. Baudoin, S. Le Roy, G. Teyssedre, and C. Laurent, J. Phys. D: Appl. Phys., 41, 025306 (2008).   DOI   ScienceOn
2 F. Rogti, Journal of Electrostatics, 71, 1046 (2013).   DOI   ScienceOn
3 F. Rogti and M. Ferhat, Appl. Phys. Lett., 104, 031605 (2014); doi: 10.1063/1.4862061   DOI   ScienceOn
4 J. M. Alison and R. Hill, J. Phys. D: Appl. Phys., 27, 1291 (1994).   DOI   ScienceOn
5 S. Le Roy, P. Segur, G. Teyssedre, and C. Laurent, J. Phys. D: Appl. Phys., 37, 298 (2004).   DOI   ScienceOn
6 G. Hen and S. Han Loi, Mater. Res. Soc. Symp., 889, W08-06-1/6 (2006) .
7 K. Kaneko, Y. Suzuoki, and T. Mizutani, IEEE Trans. Dielectr. Electr. Insul., 6, 152 (1999).   DOI   ScienceOn
8 M. Fukuma, M. Nago, and M. Kosaki, Proc. 4th Int Conf. on Properties and Applications of Dielectric Materials (Brisbane, 1994) p. 24-27.
9 E. Belgaroui, I. Boukhris, A. Kallel, G. Teyssedre, and C. Laurent, J. Phys. D: Appl. Phys., 40, 6760 (2007).   DOI   ScienceOn