Browse > Article
http://dx.doi.org/10.4313/TEEM.2012.13.4.181

Control of Connectivity of Ni Electrode with Heating Rates During Sintering and Electrical Properties in BaTiO3 Based Multilayer Ceramic Capacitors  

Yoon, J.R. (R&D Center, SAMWHA CAPACITOR CO. Ltd.)
Shin, D.S. (R&D Center, SAMWHA CAPACITOR CO. Ltd.)
Jeong, D.Y. (Department of Materials Engineering, Inha University)
Lee, H.Y. (Department of Electric Engineering, MyoungJi University)
Publication Information
Transactions on Electrical and Electronic Materials / v.13, no.4, 2012 , pp. 181-184 More about this Journal
Abstract
$BaTiO_3$ based multilayer ceramic capacitors with Ni electrodes can be explained as 2-2 composites with different thermal expansion coefficient and sintering behaviors. To achieve the high capacitance and reliability of MLCCs, a homogenous Ni electrode configuration with high connectivity is required. We controlled the heating rates during sintering to achieve densification by suppressing grain growth. Experimental results revealed that a large heating rate gave high connectivity of Ni electrode, high capacitance, small dissipation factor, high breakdown voltage, and high reliability of MLCC chips.
Keywords
MLCC; $BaTiO_3$; Heating rate; Ni Electrode; Reliability;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Electrical Industry Alliance (EIA), World Capacitor Trade Statistics (WCTS), (2003)
2 H. Kishi, Y. Mizuno and H. Chazono, Jpn. J. Appl. Phys, 42[1], 1, (2003) [DOI: 10.1143/JJAP.42.1]   DOI
3 Z. Tian, X. Wang, S. G. Lee, K. H. Hur, and L. Li, J. Am. Ceram. Soc. 94[4], 1119 (2011) [DOI:10.1111/j.1551-2916.2010.04058.x]   DOI   ScienceOn
4 Z. Tian, X.Wang, L. Shu, T. Wang, T. H. Song, Z. Gul, and L. Li, J. Am. Ceram. Soc. 92[4], 830 (2009) [DOI:10.1111/j.1551-2916.2009.03514.x]
5 I. Fujii, M. Ugorek, Y. Han, and S. T. McKinstry, J. Am. Ceram. Soc. 93[4], 1081 (2010)[DOI:10.1063/1.3428423]   DOI   ScienceOn
6 D. E. Mccauley, M. S. H. Chu, and M. H. Megherhi, J. Am. Ceram. Soc. 89[1], 193 (2006) [DOI: 10.1111/j.1551-2916.2005.00661.x]   DOI   ScienceOn
7 Jerry C. C. Lin, W. C. J. Wei, and C. Y. Huang, J. Am. Ceram. Soc. 93[12], 4103 (2010) [DOI: 10.1111/j.1551-2916.2010.04014.x]   DOI   ScienceOn
8 J. R. Yoon, K. M. Lee, and S. W. Lee, Trans. EEM 10[1], 5, (2009)
9 H. W. Lee, M. S. H. Chu, and H. Y. Lu, J. Am. Ceram. Soc. 94[5], 1556 (2011) [DOI : 10.1111/j.1551-2916.2010.04248.x]   DOI   ScienceOn
10 A. V. Polotai, G. Y. Yang, E. C. Dickey, and C. A. Randall, J. Am. Ceram. Soc. 90[12], 3811 (2007) [DOI: 10.1111/j.1551-2916.2007.02058.x]
11 A. V. Polotai, I. Fujii, D. P. Shay, G. Y. Yang, E. C. Dickey, and C. A. Randall, J. Am. Ceram. Soc. 91[8], 2540 (2008) [DOI: 10,1111/j.1555-2916.2008.02517.x]
12 C. A. Randall, J. Ceram. Soc. J pn., 109[1], S2-6, (2006) [DOI: 10.111/j.1551-2916.2009.03121.x]