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http://dx.doi.org/10.4313/TEEM.2012.13.2.85

Long-term AC Electrical Treeing Behaviors of Epoxy/Layered Silicate Nanocomposites Prepared by a 3-Roll Mill  

Park, Jae-Jun (Department of Electrical and Electronic Engineering, Joongbu University)
Publication Information
Transactions on Electrical and Electronic Materials / v.13, no.2, 2012 , pp. 85-88 More about this Journal
Abstract
Studies on the effects of layered silicate content on the AC electrical treeing and breakdown behaviors of epoxy/layered silicate nanocomposites were carried out in needle-plate electrode geometry. Wide-angle X-ray diffraction (WAXD) analysis and transmission electron microscopy (TEM) observation showed that 1 wt% of the multilayered silicate was fully exfoliated into nano-sized monolayers in the epoxy matrix however, over 3 wt% of the silicate was in an intercalated state. When 1 wt% layered silicates were incorporated, an electrical tree was initiated in 439 min and propagated at a speed of 2.3 ${\mu}m$/min after applying 781.4 kV/mm, representing a decreased in starting initiation time by a factor of 11.0 and increase in propagation speed by a factor 8.2 in comparison with neat epoxy resin. These values were in great decline after the layered silicate content was increased to 3wt% which implies that the exfoliated silicate blocked the tree initiation and propagation processes effectively. However the effect was largely decreased in the intercalated state.
Keywords
Electrical treeing; Electrical insulation breakdown strength; Epoxy nanocomposites; Layered silicate;
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1 T. Tanaka, G. C. Montanari and R. Mulhaupt, IEEE Trans. Dielectr. Electr. Insul., 11, 763 (2004) [DOI: 10.1109/ TDEI.2004.1349782].   DOI   ScienceOn
2 T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako and T. Tanaka, Intern. Sympos. Electr. Insulating Materials, Kitakyushu, Japan, pp. 239 (2005) [DOI: 10.1109/ISEIM.2005.193387].
3 J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul. 17, 1516 (2010) [DOI: 10.1109/TDEI.2010.5595553].   DOI   ScienceOn
4 R. Sarathi, R. K. Sahu and P. Rajeshkumar, Mater. Sci. Eng.: A, 445, 567 (2007) [DOI: 10.1016/j.msea.2006.09.077].
5 N. Hayakawa, H. Maeda, S. Chigusa and H. Okubo, Cryogenics, 40, 167 (2000) [DOI: 10.1016/S0011-2275(00)00024-2].   DOI   ScienceOn
6 X. Zheng and G. Chen, IEEE Transactions on Dielectrics and Electrical Insulation, 15, 800 (2008) [DOI: 10.1109/ TDEI.2008.4543118].   DOI   ScienceOn
7 R. Vogelsang, R. Brutsch, T. Frohlich, Conference on Electrical Insulation and Dielectric Phenomena, Cancun, Mexico, p.946 (2002).
8 Y. Chen, T. Imai, Y. Ohki and T. Tanaka, IEEE Transactions on Dielectrics and Electrical Insulation, 17, 1509 (2010) [DOI: 10.1109/TDEI.2010.5595552].   DOI   ScienceOn
9 J. H. Mason, Proc. IEE C, 102, 254 (1955).
10 T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako and T. Tanaka, IEEE Trans. Dielectr. Electr. Insul., 13, 445 (2006) [DOI: 10.1109/TDEI.2006.1624291].   DOI   ScienceOn
11 X. Kornmann, "Synthesis and characterisation of thermosetclay nanocomposites", Ph.D. dissertation from Lulea, Lulea Tekniska University, Sweden, pp.13-17 (2001).
12 K. Theodosiou and I. Gialas, J. Electr. Eng., 59, 248 (2008).