1 |
T. Tanaka, G. C. Montanari and R. Mulhaupt, IEEE Trans. Dielectr. Electr. Insul., 11, 763 (2004) [DOI: 10.1109/ TDEI.2004.1349782].
DOI
ScienceOn
|
2 |
T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako and T. Tanaka, Intern. Sympos. Electr. Insulating Materials, Kitakyushu, Japan, pp. 239 (2005) [DOI: 10.1109/ISEIM.2005.193387].
|
3 |
J. J. Park and J. Y. Lee, IEEE Trans. Dielectr. Electr. Insul. 17, 1516 (2010) [DOI: 10.1109/TDEI.2010.5595553].
DOI
ScienceOn
|
4 |
R. Sarathi, R. K. Sahu and P. Rajeshkumar, Mater. Sci. Eng.: A, 445, 567 (2007) [DOI: 10.1016/j.msea.2006.09.077].
|
5 |
N. Hayakawa, H. Maeda, S. Chigusa and H. Okubo, Cryogenics, 40, 167 (2000) [DOI: 10.1016/S0011-2275(00)00024-2].
DOI
ScienceOn
|
6 |
X. Zheng and G. Chen, IEEE Transactions on Dielectrics and Electrical Insulation, 15, 800 (2008) [DOI: 10.1109/ TDEI.2008.4543118].
DOI
ScienceOn
|
7 |
R. Vogelsang, R. Brutsch, T. Frohlich, Conference on Electrical Insulation and Dielectric Phenomena, Cancun, Mexico, p.946 (2002).
|
8 |
Y. Chen, T. Imai, Y. Ohki and T. Tanaka, IEEE Transactions on Dielectrics and Electrical Insulation, 17, 1509 (2010) [DOI: 10.1109/TDEI.2010.5595552].
DOI
ScienceOn
|
9 |
J. H. Mason, Proc. IEE C, 102, 254 (1955).
|
10 |
T. Imai, F. Sawa, T. Ozaki, T. Shimizu, R. Kido, M. Kozako and T. Tanaka, IEEE Trans. Dielectr. Electr. Insul., 13, 445 (2006) [DOI: 10.1109/TDEI.2006.1624291].
DOI
ScienceOn
|
11 |
X. Kornmann, "Synthesis and characterisation of thermosetclay nanocomposites", Ph.D. dissertation from Lulea, Lulea Tekniska University, Sweden, pp.13-17 (2001).
|
12 |
K. Theodosiou and I. Gialas, J. Electr. Eng., 59, 248 (2008).
|