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http://dx.doi.org/10.4313/TEEM.2011.12.4.160

Improvement of Electrical and Thermal Characteristics of Nano-Micro Epoxy Composite  

Cho, Sung-Hoon (School of Electrical Engineering, Chungbuk National University)
Kim, Yu-Min (School of Electrical Engineering, Chungbuk National University)
Kwon, Jung-Hun (School of Electrical Engineering, Chungbuk National University)
Lim, Kee-Joe (School of Electrical Engineering, Chungbuk National University)
Jung, Eui-Hwan (LS Cable Corporation)
Lee, Hung-Kyu (Department of Electrical Engineering, Chungju National University)
Shin, Pan-Seok (Department of Electrical Engineering, Hongik University)
Publication Information
Transactions on Electrical and Electronic Materials / v.12, no.4, 2011 , pp. 160-163 More about this Journal
Abstract
Polymer nanocomposite has been attracting more attention as a new insulation material because homogeneous dispersion of nano-sized inorganic fillers can improve various properties significantly. In this paper, various kinds of epoxy-based nanocomposites were made, and the AC breakdown strengths of Nano filler and micro-$SiO_2$ filler mixtures of epoxy-based composites were analyzed using sphere-to-sphere electrodes. Moreover, nano- and microfiller combinations were investigated as an approach to practical application of nanocomposite insulation materials. Its composition ratio was 100 (resin):82 (hardener):1.5 (accelerator). AC breakdown tests were performed at room temperature ($25^{\circ}C$), $80^{\circ}C$, and $100^{\circ}C$ in the vicinity of $T_g$ ($90^{\circ}C$). Thermal conductivity was measured using TC-30.
Keywords
Nanocomposite; Epoxy; Thermal conductivity; Thermal expansion coefficient;
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