1 |
C. J. Xian, J. H. Park, K. C. Ahn, S. G. Yoon, J. W. Lee, W. C. Kim, S. T. Lim, S. H. Sohn, J. S. Moon, H. M. Jung, S. E. Lee, I. H. Lee, Y. K. Chung, M. K. Jean, and S. I. Woo, 'Electrical properties of (BMN) pyrochlore thin films deposited on Pt and Cu metal at low temperatures for embedded capacitor applications', Appl. Phys. Lett., Vol. 90, p. 052903, 2007
DOI
ScienceOn
|
2 |
H. Pohl, 'Superdielectrics polymers', IEEE Trans. Electrical Insulation, Vol. EI 21, No.5, p. 683, 1986
|
3 |
G. M. Safronov, V. N. Batag, T. V. Stepanyuk, and P. M. Fedorov, 'Equilibrium diagram of bismuth oxide-zinc oxide system', Russ. J. Inorg. Chem., Vol. 16, p. 460, 1971
|
4 |
D. P. Cann, C. A. Randall, and T. R. Shrout, 'Investigation of the dielectric properties of bismuth pyrochlores', Solid State Commun., Vol. 100, p. 529, 1996
|
5 |
J. Lu and S. Stemmer, 'Low-loss, tunable bismuth zinc niobate films deposited by RF magnetron sputtering', Appl. Phys. Lett., Vol. 83, p. 2411, 2003
DOI
ScienceOn
|
6 |
S. W. Wang, W. Lu, N. Li, Z. F. Li, H. Wang, M. Wang, and X. C. Shen, 'Insulating properties of rapid thermally processed thin films by a chemical solution decomposition technique', Mater. Res. Bull., Vol. 37, p. 1691,2002
|
7 |
J. H. Park, W. S. Lee, N. J. Seong, S. G. Yoon, S. H Son, H. M. Chung, J. S. Moon, H. J. Jin, S. E. Lee, J. W. Lee, H. D. Kang, Y. K. Chung, and Y. S. Oh, 'Bismuth-zinc-niobate embedded capacitors grown at room temperature for printed circuit board applications', Appl. Phys. Lett., Vol. 88, p. 192902, 2006
DOI
ScienceOn
|
8 |
J. H. Park, C. J. Xian, N. J. Seong, S. G. Yoon, S. H Son, H. M. Chung, J. S. Moon, H. J. Jin, S. E. Lee, J. W. Lee, H. D. Kang, and Y. K. Chung, 'Bismuthbased pyrochlore thin films deposited at low temperatures for embedded capacitor applications', Jpn. J. of Applied Physics part 1, Vol. 45, p. 7325, 2006
DOI
|
9 |
J. H. Park, C. J. Xian, N. J. Seong, S. G. Yo on, S. H Son, H. M. Chung, J. S. Moon, H. J. Jin, S. E. Lee, J. W. Lee, H. D. Kang, Y. K. Chung, and Y. S. Oh, 'Realization of a high capacitance density in pyrochlore thin films deposited directly on polymer substrates for embedded capacitor applications', Appl. Phys. Lett., Vol. 89, No. 23,p. 232910,2006
DOI
ScienceOn
|
10 |
T. Kim, A. I. Kingon, J. P. Maria, and R. T. Croswell, 'Ca-doped lead zirxonate titanate thin film capacitors on base metal nickel on copper foil', J. Mater. Res., Vol. 19, No. 10, p. 2841, 2004
DOI
ScienceOn
|
11 |
Y. Rao, S. Ogitani, P. Kohl, and C. P. Wong, 'Novel high-dielectric constant nano-structure polymer-ceramic composite for embedded capacitor application', Proc. ECTC., Vol. 183, p. 183,2000
|
12 |
D. G. Weiss, 'Changes in the PCB world with new packaging technologies and the integration of passive components into the PCB', Circuit World, Vol. 24, No.2, p. 6, 1998
|
13 |
S. Ramesh, B. A. Shutzberg, C. Huang, J. Gao, and E. P. Giannelis, 'Dielectric nanocomposites for integral thin film capacitors: Materials design, fabrication and integration issues', IEEE Trans. Adv. Packaging, Vol. 26, No.1, p. 17,2003
DOI
ScienceOn
|