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http://dx.doi.org/10.1007/s43236-021-00291-z

Design of miniaturized and lightweight coupling inductors for interleaved parallel DC/DC converters  

Wang, Yifeng (School of Electrical and Information Engineering, Tianjin University)
Cheng, Pengyu (School of Electrical and Information Engineering, Tianjin University)
Ma, Xiaoyong (School of Electrical and Information Engineering, Tianjin University)
Tao, Long (School of Electrical and Information Engineering, Tianjin University)
Zhao, Danfeng (School of Electrical and Information Engineering, Tianjin University)
Publication Information
Journal of Power Electronics / v.21, no.10, 2021 , pp. 1439-1450 More about this Journal
Abstract
At present, coupled inductance is an effective method for the development of the interleaved parallel converters in terms of high efficiency, miniaturization, and light weight. In view of the difficulty in designing coupling inductors in multiphase interleaved parallel converters, a general coupling inductor design criterion is proposed in this paper. First, the equivalent steady-state inductance and equivalent transient inductance expressions of a converter are obtained according to the modal transformation law of a two-phase interleaved parallel buck converter circuit. In addition, the volume modeling and weight modeling of the core are established, and expressions of the self-inductance and coupling coefficient are obtained. Then, the self-inductance and coupling coefficients are derived with the constraints of the steady-state current ripple and transient response speed as well as the objective function of the volume modeling and weight modeling. It is ensured that the designed coupled inductor successfully achieves its purposes of reducing the volume, weight, and inductor current ripple of the converter while improving the system response speed. Finally, the correctness of the theoretical analysis and the accuracy of the design method were verified on a 40 kW experimental platform based on a SiC MOSFET.
Keywords
Coupling inductor; Interleaving technique; Miniaturization; Lightweight; SiC MOSFET;
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