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http://dx.doi.org/10.1016/j.cap.2018.09.002

Thermal stability and Young's modulus of mechanically exfoliated flexible mica  

Jin, Da Woon (Department of Physics, Inha University)
Ko, Young Joon (Department of Physics, Inha University)
Kong, Dae Sol (Department of Physics, Inha University)
Kim, Hyun Ki (Department of Physics, Inha University)
Ha, Jae-Hyun (Department of Emerging Materials Science, DGIST)
Lee, Minbaek (Department of Physics, Inha University)
Hong, Jung-Il (Department of Emerging Materials Science, DGIST)
Jung, Jong Hoon (Department of Physics, Inha University)
Publication Information
Current Applied Physics / v.18, no.12, 2018 , pp. 1486-1491 More about this Journal
Abstract
In recent years, mica has been successfully used as a substrate for the growth of flexible epitaxial ferroelectric oxide thin films. Here, we systematically investigated the flexibility of mica in terms of its thickness, repeated bending/unbending, extremely hot/cold conditions, and successive thermal cycling. A $20-{\mu}m-thick$ sheet of mica is flexible even up to the bending radius of 5 mm, and it is durable for 20,000 cycles of up- and down-bending. In addition, the mica shows flexibility at 10 and 773 K, and thermal cycling stability for the temperature variation of ca. 400 K. Compared with the widely used flexible polyimide, mica has a significantly higher Young's modulus (ca. 5.4 GPa) and negligible hysteresis in the force-displacement curve. These results show that mica should be a suitable substrate for piezoelectric energy-harvesting applications of ferroelectric oxide thin films at extremely low and high temperatures.
Keywords
Flexible mica; Thermal stability; Young's modulus;
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