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http://dx.doi.org/10.1016/j.cap.2018.08.002

Microscopic damping mechanism of micro-porous metal films  

Du, Guangyu (Key Laboratory of Vibration and Control of Aeronautical Equipment, Ministry of Education, Northeastern University)
Tan, Zhen (Shenyang Radio and TV University)
Li, Zhuolong (Key Laboratory of Vibration and Control of Aeronautical Equipment, Ministry of Education, Northeastern University)
Liu, Kun (Key Laboratory of Vibration and Control of Aeronautical Equipment, Ministry of Education, Northeastern University)
Lin, Zeng (Key Laboratory of Vibration and Control of Aeronautical Equipment, Ministry of Education, Northeastern University)
Ba, Yaoshuai (Key Laboratory of Vibration and Control of Aeronautical Equipment, Ministry of Education, Northeastern University)
Ba, Dechun (Key Laboratory of Vibration and Control of Aeronautical Equipment, Ministry of Education, Northeastern University)
Publication Information
Current Applied Physics / v.18, no.11, 2018 , pp. 1388-1392 More about this Journal
Abstract
Metal thin films are used widely to solve the vibration problem. However, damping mechanism is still not clear, which limits the further improvement of the damping properties for film and the development of multi-functional damping coating. In this paper, Damping microscopic mechanism of porous metal films was investigated at both macroscopically and microscopically mixed levels. Molecular dynamics simulation method was used to model and simulate the loading-unloading numerical experiment on the micro-pore and vacancy model to get the stress-strain curve and the microstructure diagram of different defects. And damping factor was calculated by the stress-strain curve. The results show that dislocations and new vacancies appear in the micro-pores when metal film is stretched. The energetic consumption from the motion of dislocation is the main reason for the damping properties of materials. Micro-mechanism of damping properties is discussed with the results of in-situ experiment.
Keywords
Micro-pore; Microstructure; Metal thin film; Damping mechanism; Molecular dynamics;
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