Tribological Properties of Ultrathin DLC Films with and without Metal Interlayers |
Jeon, Young-Sook
(School of Information and Communication Engineering, and Center for Advanced Plasma Surface Technology, Sungkyunkwan University)
Park, Yong-Seob (School of Information and Communication Engineering, and Center for Advanced Plasma Surface Technology, Sungkyunkwan University) Kim, Hyung-Jin (School of Information and Communication Engineering, and Center for Advanced Plasma Surface Technology, Sungkyunkwan University) Hong, Byung-You (School of Information and Communication Engineering, and Center for Advanced Plasma Surface Technology, Sungkyunkwan University) Choi, Won-Seok (Department of Electrical Engineering, Hanbat National University) |
1 | Y. S. Park, H. J. Kim and B. Hong, J. Korean Phys. Soc. 45, S824 (2004) |
2 | S. H. Lee, H. T. Kim, H. Ryu, J. H. Cho and D. K. Park, J. Korean Phys. Soc. 42, S980 (2003) |
3 | P. R. Goglia, J. Berkowitz, J. Hoehn, A. Xidis and L. Stover, Diam. Relat. Mater. 10, 271 (2001) DOI ScienceOn |
4 | I. S. Bae, S. H. Cho, S. B. Lee, Y. Kim and J. H. Boo, Surf. Coat. Tech. 193, 142 (2005) DOI |
5 | S. G. Ha, J. G. Lee and S. P. Lee, J. Korean Phys. Soc. 45, 1268 (2004) |
6 | J. Robertson, Thin Solid Films 383, 81 (2001) DOI |
7 | Y. H. Son, W. C. Jung, N. G. Park, I. S. Kim, I. H. Bae and J. I. Jeong, J. Korean Phys. Soc. 39, 713 (2001) |
8 | V. Bursikova, V. Navratil, L. Zajickova and J. Janca, Mat. Sci. Eng. A 324, 251 (2002) |
9 | S. Maeng, S. Lee, A. Tagliaferro, J. Robertson and W. I. Milne, J. Korean Phys. Soc. 45, 950 (2004) |
10 | A. Grill, Thin Solid Films 355-356, 189 (1999) |
11 | H. Ohno, J. A. van den Berg, S. Nagai and D.G. Armour, Nucl. Instrum. Meth. B 148, 673 (1999) |
12 | K. J. Clay, S.P. Speakman, N.A. Morrison, N. Tomozeiu, W. I. Milne and A. Kapoor, Diam. Relat. Mater. 7, 1100 (1998) |
13 | C. K. Lee, C. D. Hsieh and B. H. Tseng, Thin Solid Films 303, 232 (1997) |