Measurement of the Internal Structure of an Optical Waveguide Embedded in a Flexible Optical Circuit Board by Enhancing the Signal Contrast of a Confocal Microscope |
Lee, Won-Jun
(Department of Information and Communication Engineering, INHA University)
Kim, Dae-Chan (Department of Information and Communication Engineering, INHA University) O, Beom-Hoan (Department of Information and Communication Engineering, INHA University) Park, Se-Geun (Department of Information and Communication Engineering, INHA University) Lee, El-Hang (Department of Information and Communication Engineering, INHA University) Lee, Seung-Gol (Department of Information and Communication Engineering, INHA University) |
1 | S. Lindek and E. H. K. Stelzer, “Optical transfer functionsfor confocal theta fluorescence microscopy,” J. Opt. Soc.Am. A 13, 479-482 (1996). DOI |
2 | M. J. Mandella, M. H. Garrett, and G. S. Kino, “Integratedangled-dual-axis confocal scanning endoscopes,” U.S. Patent 6522444 (2003). |
3 | M. J. Mandella, G. S. Kino, and N. Y. Chan, “Dual-axisconfocal microscope having improved performance forthick samples,” U.S. Patent 7242521 (2007). |
4 | G. Scarcelli and S. H. Yun, “Confocal Brillouin microscopyfor three-dimensional mechanical imaging,” Nature Photonics2, 39-43 (2008). DOI |
5 | P. J. Dwyer, C. A. Dimarzio, and M. Rajadhyaksha, “Confocaltheta line-scanning microscope for imaging human tissues,”Appl. Opt. 46, 1843-1851 (2007). DOI |
6 | T. Dabbs and M. Glass, “Fiber-optic confocal microscope,”Appl. Opt. 31, 3030-3035 (1992). DOI |
7 | L. Yang, G. Wang, J. Wang, and Z. Xu, “Surface profilometrywith a fiber optical confocal scanning microscope,”Meas. Sci. Technol. 11, 1786-1791 (2000). DOI ScienceOn |
8 | D. H. Hartman, G. R. Lalk, J. W. Howse, and R. R.Krchnavek, “Radiant cured polymer optical waveguides onprinted circuit boards for photonic interconnection use,” Appl.Opt. 28, 40-47 (1989). DOI |
9 | E.-H. Lee, S. G. Lee, B. H. O, and S.-G. Park, “Polymer-basedoptical printed circuit board (O-PCB) as a potentialplatform for VLSI microphotonic integration,” J. NonlinearOpt. Phys. & Mater. 14, 409-425 (2005). DOI ScienceOn |
10 | B.-H. Lee, N.-H. Shin, K. Jeong, M.-J. Park, B.-G. Kim,J.-H. Yoo, D.-G. Kim, K.-H. Yun, K.-S. Lee, K.-H. Kim,D.-K. Kim, and S.-H. Park, “Nondestructive optical measurementof refractive-index profile of graded-index lenses,” J.Opt. Soc. Korea 13, 468-471 (2009). 과학기술학회마을 DOI ScienceOn |
11 | D.-S. Park, B.-H. O, S.-G. Park, E.-H. Lee, J.-H. Park, andS.-G. Lee, “Noise-robust phase gradient retrieval formulationfor phase-shifting interferometry,” J. Opt. Soc. Korea 14,131-136 (2010). 과학기술학회마을 DOI ScienceOn |
12 | T. Wilson, Confocal Microscope (Academic Press, Oxford,UK, 1990). |
13 | G. Min, Principles of Three-dimensional Imaging inConfocal Microscopes (World Scientific, Singapore, 1996). |
14 | R. Kassies, K. O. Van Der Werf, A. Lenferink, C. N.Hunter, J. D. Olsen, V. Subramaniam, and C. Otto, “CombinedAFM and confocal fluorescence microscope for applicationsin bio-nanotechnology,” J. Microscopy 217, 109-116 (2004). |
15 | A. Gerger, R. Hofmann-Wellenhof, U. Langsenlehner, E.Richtig, S. Koller, W. Weger, V. Ahlgrimm-Siess, M.Horn, H. Samonigg, and J. Smolle, “In vivo confocal laserscanning microscopy of melanocytic skin tumours diagnosticapplicability using unselected tumour images,” Br. J.Dermatol. 158, 329-333 (2008). DOI ScienceOn |
16 | C. R. Fairley, T.-Y. Fu, B.-M. B. Tsai, and S. A. Young,“Confocal wafer inspection system and method,” U.S. Patent 0273196 (2008). |
17 | S. Lindek, C. Cremer, and E. H. K. Stelzer, “Confocaltheta fluorescence microscopy with annular apertures,” Appl.Opt. 35, 126-130 (1996). DOI |
18 | G. L. Bona, B. J. Offreina, U. Bapsta, C. Bergera, R.Beyelera, R. Buddb, R. Dangela, L. Dellmanna, and F. Horsta,“Characterization of parallel optical-interconnect waveguidesintegrated on a printed circuit board,” Proc. SPIE 5453,134-141 (2004). DOI |
19 | C. Choi, L. Lin, Y. Liu, J. Choi, L. Wang, D. Haas, J. Magera,and R. T. Chen, “Flexible optical waveguide film fabricationsand optoelectronic devices integration for fully embeddedboard level optical interconnects,” J. Lightwave Technol.22, 2168-2176 (2004). DOI ScienceOn |