[KSCI] Korea Science Citation Index Service

http://dx.doi.org/10.4283/JMAG.2016.21.4.524

Tilt Angle Measurement Based on Arrayed Eddy Current Sensors

Chao, Xuewei (College of Mechanical and Electrical Engineering, Shihezi University)
Li, Yang (College of Mechanical and Electrical Engineering, Shihezi University)
Nie, Jing (College of Mechanical and Electrical Engineering, Shihezi University)

Publication Information

Journal of Magnetics / v.21, no.4, 2016 , pp. 524-528 More about this Journal

Abstract

Eddy current (EC) sensor works based on the electromagnetic induction principle and has been widely applied in the industrial testing and evaluation due to its robustness and environmental adaptability. Meanwhile, tilt angle measurement is mainly based on the laser or visual method, which is strict with the measurement environment and not suitable for the industrial applications. In this paper, a novel tilt angle measurement method based on arrayed EC sensors is proposed. Both the simulation and experiments indicate that the measured error is approximately linear with tilt angle and the accuracy after compensation is $0.25^{\circ}$ . In conclusion, this research cannot only broaden the scope of EC application, but also overcome the shortcomings of existing angle measurement methods.

Keywords

eddy current; tilt angle; electromagnetic; measurement; inclined plate;

Citations & Related Records

Reference

1	M. C. Hsieh, J. Y. Lin, and C. O. Chang, Sensors 16, 1301 (2016). DOI
2	Y. Yu, G. Tian, X. Li, and A. Simm, Nondestruct Test Eval. 28, 195 (2013). DOI
3	Y. Yu, T. Y, and P. Du, NDT E Int. 48, 16 (2012). DOI
4	H. Wang, B. Ju, W. Li, and Z. Feng, Sens Actuators Phys. 211, 98 (2014). DOI
5	L. Banteng, H. Dibo, L. Baoling, Z. Ling, H. Pingjie, and Z. Guangxin, Insight - Non-Destr Test Cond Monit. 56, 375 (2014). DOI
6	M. Pan, Y. He, G. Tian, D. Chen, and F. Luo, Ndt E Int. 52, 28 (2012). DOI
7	Y. He, M. Pan, F. Luo, and G. Tian, Ndt E Int. 44, 344 (2011). DOI
8	I. D. Adewale and G. Y. Tian, IEEE Trans. Magn. 49, 1119 (2013). DOI
9	W. Yin, P. J. Withers, U. Sharma, and A. J. Peyton, IEEE Trans Instrum Meas. 58, 738 (2009). DOI
10	T. Bouchala, B. Abdelhadi, and A. Benoudjit, Nondestruct Test Eval. 30, 63 (2015). DOI
11	Y. Li, X. Sheng, M. Lian, and Y. Wang, Nondestruct Test Eval. 31, 289 (2016). DOI
12	S. Zhao, Y. Li, E. Zhang, P. Huang, and H. Wei, Rev. Sci. Instrum. 85, 96 (2014).
13	M. Lian, H. Liu, Y. Wang, Y. Li, X. Sheng, and Y. Ying, Int. J. Automation Technology 10, 977 (2016). DOI