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http://dx.doi.org/10.4283/JMAG.2013.18.4.417

Current Density and Thickness Effects on Magnetic Properties of Electrodeposited CoPt Magnetic Films  

Kim, Hyeon Soo (Department of Physics and Research Institute of Natural Science, Gyeongsang National University)
Jeong, Soon Young (Department of Physics and Research Institute of Natural Science, Gyeongsang National University)
Suh, Su Jeong (School of Advanced Materials Science and Engineering, Sungkyunkwan University)
Publication Information
Journal of Magnetics / v.18, no.4, 2013 , pp. 417-421 More about this Journal
Abstract
The dominant magnetization reversal behavior of electrodeposited CoPt samples with various thicknesses deposited at different current densities was the domain wall motion by means of wall pinning. The magnetic interaction mechanism was dipolar interaction for all samples. The dipolar interaction strength was significantly affected by the sample thickness rather than by the current density, while the magnetic properties were closely related to the current density.
Keywords
CoPt magnetic film; current density; thickness; domain wall motion; wall pinning; dipolar interaction;
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1 N. V. Myung, D. Y. Park, M. Schwartz, K. Nobe, H. Yang, C.-K. Yang, and J. W. Judy, Proc. Electrochem. Soc. (2000).
2 I. Zana, G. Zangari, J.-W. Park, and M. G. Allen, J. Magn. Magn. Mater. 272, e1775 (2004).
3 I. Zana, G. Zangari, and M. Shamsuzzoha, J. Magn. Magn. Mater. 292, 266 (2005).   DOI   ScienceOn
4 G. Bottoni, D. Candolfo, and A. Cecchetti, J. Appl. Phys. 81, 3809 (1997).   DOI   ScienceOn
5 H. Ohmori and A. Maesaka, J. Appl. Phys. 91, 8635 (2002).   DOI   ScienceOn
6 M. P. Sharrock, IEEE Trans. Magn. 26, 193 (1990).   DOI   ScienceOn
7 P. Lu and S. H. Charap, J. Appl. Phys. 75, 5768 (1994).   DOI   ScienceOn
8 M. Ghidini, A. Lodi-Rizzini, C. Pernechele, M. Solzi, R. Pellicelli, G. Zangari, and P. Vavassori, J. Magn. Magn. Mater. 322, 1576 (2010).   DOI
9 Fernando, M. F. Rhen, and J. M. D. Coeys, J. Magn. Magn. Mater. 272, e883 (2004).
10 I. Zana and G. Zangari, J. Magn. Magn. Mater. 272, 1698 (2004).
11 S. H. Kim, J. D. Lee, S. Y. Jeong, H. C. Lee, and S. J. Suh, J. Kor. Mag. Soc. 21, 151 (2011).   DOI   ScienceOn
12 H. Fujimori, O. Suzuki N. Hosoya, X. B. Yang, and H. Morita, IEEE Trans. 30, 4038 (1994).
13 T. Thomson and K. O'Grady, J. Appl. Phys. 30, 1566 (1997).
14 A. R. Corradi and E. P. Wohlfarth, IEEE Trans. Magn. 14, 861 (1978).   DOI
15 E. P. Wohlfarth, J. Appl. Phys. 29, 595 (1958).
16 O. Henkel, Phys. Status Solid. 7, 919 (1964).   DOI
17 P. E. Kelly, K. O'Grady, P. I. Mayo, and R. W. Chantrell, IEEE Trans. Magn. 25, 3881 (1989).   DOI   ScienceOn
18 M. Ghidini, G. Asti, C. Pernechele, L. Prejbeanu, M. Solzi, and G. Zangari, J. Magn. Magn. Mater. 316, e112 (2007).   DOI   ScienceOn
19 I. Zana, G. Zangari, and M. Shamsuzzoha, J. Electrochem. Soc. 151, C637 (2004).   DOI   ScienceOn