Effect of Electrodeposition Condition on GMR Co/Cu Multilayers

Co/Cu GMR multilayers were electrodeposited from various electrolytes using the dual bath technique to achieve high sensitive GMR multilayers. GMR ratio and sensitivity were strongly influenced by solution compositions and electrodeposition parameters where GMR and sensitivity of 12% and 0.052%/Oe were achieved from pyrophosphate baths. The effect of plating conditions on properties of Co/Cu multilayers may be attributed to crystallinity and grain size of deposits, and the ability of plating solutions to deposit contiguous films at lower nano thicknesses.