Browse > Article

The Influences of Residual Stress on the Frequency of Ultrasonic Transducers with Composite Membrane Structure  

Lee Seungmock (Technology Research Institute of Osaka Prefecture)
Kim Jong-Min (School of Mechanical Engineering, Chung-Ang University)
Shin Young-Eui (School of Mechanical Engineering, Chung-Ang University)
Publication Information
Journal of Mechanical Science and Technology / v.20, no.1, 2006 , pp. 76-84 More about this Journal
Abstract
Arrayed ultrasonic sensors based on the piezoelectric thin film (lead-zirconate-titanate: Pb($Zr_{0.52}Ti_{0.48})O_{3}$) having composite membrane structure are fabricated. Different thermal and elastic characteristics of each layer generate the residual stress during the high temperature deposition processes, accomplished diaphragm is consequently bowing. We present the membrane deflection effects originated from the residual stress on the resonant frequencies of the sensor chips. The resonant frequencies ($f_r$) measured of each sensor structures are located in the range of $87.6{\sim}111\;kHz$, these are larger $30{\sim}40\;kHz$ than the resultant frequencies of FEM. The primary factors of $f_r$ deviations from the ideal FEM results are the membrane deflections, and the influence of stiffness variations are not so large on that. Membrane deflections have the effect of total thickness increase which sensitively change the $f_r$ to the positive direction. Stress generations of the membrane are also numerically predicted for considering the effect of stiffness variations on the $f_r$.
Keywords
Stress; Resonant Frequency; Ultrasonic Sensor; Sensitivity; Membrane;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By Web Of Science : 2  (Related Records In Web of Science)
Times Cited By SCOPUS : 2
연도 인용수 순위
1 Spierings, G. A. C. M., Dormans, G. J. M. et aI., 1995, 'Stresses in $Pt/Pb(Zr, Ti)O_3/Pt$ ThinFilm Stacks for Integrated Ferroelectric Capacitors,' J. Appl. Phys., Vol. 78, No.3, pp. 1926-1933   DOI   ScienceOn
2 Sze. ed, S.M., 1994, Semiconductor Sensors, Wiley Inter-Science, New York
3 Timosenko, S. and Woinowsky-Krieger, S., 1959, Theory of Plates and Shells ($2^nd$ Edt.), McGraw-Hill, New York, pp. 30
4 Townsend, P. H., Barnett D. M. et al., 1987, 'Elastic Relationships in Layered Composite Media with Approximation for the Case of Thin Films on a Thick Substrate,' J. Appl. Phys., Vol. 62, No. 11, pp. 4438-4444   DOI
5 Nayfeh, S. A., 0000, 'Damping of flexural vibration in the plane of lamination of elasticviscoelastic sandwich beams,' J. Sound and Vibration, in press
6 Okuyama, M., 2001, 'Electronic devices using the ferroelectric thin film,' T. IEE Japan, Vol. 121-E, pp. 537-541. (in Japanese)
7 Pietrzakowski, M., 2001, 'Active Damping of Beams by Oiezoelectric System : Effects of Bonding Layer Properties,' Int. J. Solids and Structures, Vol. 38, pp. 7885-7897   DOI   ScienceOn
8 Sengupta, S. S., Park, S. M. et al., 1998, 'Origins and Evolution of Stress Development in SolGel Derived Thin Layers and Multideposited Coatings of Lead Titanate,' J. Appl. Phys., Vol. 83, No.4, pp. 2291-2296   DOI   ScienceOn
9 Kim, M. T., 1996, 'Influence of Substrates on the Elastic Reaction of Films for the Microindentation Tests,' Thin Solid Films, Vol. 283, pp.12-16   DOI   ScienceOn
10 Katz, A. and Dautremont-Smith, W. C., 1990, 'Stress Measurements of $Pt/Ti/SiO_2/inP$ Systems: In Situ Measurements Through Sintering and After Rapid Thermal Processing,' J. Appl. Phys., Vol. 67, No. 10, pp. 6237-6246   DOI
11 Low, T. S. and Guo, W., 1995, 'Modeling of a Three-Layer Piezoelectric Bimorph Beam with Hysteresis,' J. MEMS, Vol. 4, No.4, pp.234-237   DOI   ScienceOn
12 Mo, Y., Tanaka, T., Inoue, K. et al., 2003, 'Front-End Processor Using BBD Distributed Delay-Sum Architecture for Micromachined Ultrasonic Sensor Array,' J. MEMS, Vol. 12, No. 12, pp. 506-512   DOI   ScienceOn
13 Harms, U., Kempen L. et al., 1998, 'Influence of Stress in Thin Film Modulus Measurements by the Vibrating Reed Technique,' Thin Solid Films, Vol. 323, pp. 153-157   DOI   ScienceOn
14 Irene, E. A. and Tierney, E., 1982, 'A Viscous Flow Model to Explain the Appearance of High Density Thermal $SiO_2$ at Low Oxidation Temperatures,' J. Electrochem. Soc., Vol. 129, No. 11, pp.2594-2597   DOI
15 Harris, C. M., 1995, Shock and Vibration Handbook (4th Edt.), McGraw-Hill, New York, pp.7.25-7.49
16 Hess, P., 1996, 'Laser Diagnostics of Mechanical and Elastic Properties of Silicon and Carbon Films,' Appl. Surf Sci., Vol. 106, pp.429-437   DOI   ScienceOn
17 Hwang, H. Y., Kim, Y. K., Kim, C., Kwon, Y. -D. and Choi, W., 2003, 'Thermo-Viscoelastic Residual Stress Analysis of Metal Linear- Inserted Composite Cylinders,' KSME International Journal, Vol. 17, No.2, pp. 171-180   DOI
18 Chinmulgund, M., Inturi, R. B. et al., 1995, 'Effect of Ar Gas Pressure on Growth, Structure, and Mechanical Properties of Sputtered Ti, AI, Ti Al, and Ti3Al Films,' Thin Solid Films, Vol. 270, pp.260-263   DOI   ScienceOn
19 Gauthier, M. M., 1995, Engineering Materials Handbook (ASM desk edt.), Materials Park, OH
20 Fitch, J. T., Bjorkman, C. H. et al., 1989, 'Intrinsic Stress and Stress Gradients at the $SiO_2/Si$ Interface in Structures Prepared by Thermal Oxidation of Si and Subjected to Rapic Thermal Annealing,' J. Vac. Sci. Technol. B, Vol. 7, No. 4, pp. 775-781   DOI