[KSCI] Korea Science Citation Index Service

Prediction of Residual Stress Distribution in Multi-Stacked Thin Film by Curvature Measurement and Iterative FEA

Choi Hyeon Chang (Department of Mechatronics Engineering, College of Engineering, Tongmyong University of Information Technology)
Park Jun Hyub (Department of Mechatronics Engineering, College of Engineering, Tongmyong University of Information Technology)

Publication Information

Journal of Mechanical Science and Technology / v.19, no.5, 2005 , pp. 1065-1071 More about this Journal

Abstract

In this study, residual stress distribution in multi-stacked film by MEMS (Micro-Electro Mechanical System) process is predicted using Finite Element method (FEM). We evelop a finite element program for residual stress analysis (RESA) in multi-stacked film. The RESA predicts the distribution of residual stress field in multi-stacked film. Curvatures of multistacked film and single layers which consist of the multi-stacked film are used as the input to the RESA. To measure those curvatures is easier than to measure a distribution of residual stress. To verify the RESA, mean stresses and stress gradients of single and multi layers are measured. The mean stresses are calculated from curvatures of deposited wafer by using Stoney's equation. The stress gradients are calculated from the vertical deflection at the end of cantilever beam. To measure the mean stress of each layer in multi-stacked film, we measure the curvature of wafer with the left film after etching layer by layer in multi-stacked film.

Keywords

MEMS; Residual Stress; Stress Distribution; Multi-stacked Film; Stress Gradient;

Citations & Related Records

Times Cited By KSCI : 1 (Citation Analysis)
Times Cited By Web Of Science : 1 (Related Records In Web of Science)
Times Cited By SCOPUS : 1

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