Measurement of the Shape in the Radioactive Area by Ultrasonic Wave Sensor |
Park, Koon-Nam
(HANARO Application Research, Korea Atomic Energy Research Institute)
Sim, Chuel-Muu (HANARO Application Research, Korea Atomic Energy Research Institute) Park, Chang-Oong (HANARO Application Research, Korea Atomic Energy Research Institute) Lee, Chang-Hee (HANARO Application Research, Korea Atomic Energy Research Institute) Park, Jong-Hark (Department of Mechanical Design Engineering, Chungnam National University) |
1 | Chang Oong Choi, Man Soon Cho, Kook Nam Park, Jae Min Sohn, Chuel Muu Sim, Young Hyun Choi, Muu Oung Lee, 1999, 'Development of Cold Neutron Source,' KAERI/RR-1916/98, pp. 117-215 |
2 | Kook Nam Park, Chuel Muu Sim, Chang Oong Choi, 2000, 'Measurement of Shape of the Cold Neutron Source Vertical Hole by Ultrasonic Wave Sensor,' Journal of the Korean Society of Mechanical Engineering Vol. A-24, No. 9, pp. 2167-2173 |
3 | Kyung Woo Kwan, Hyung Mo Kwang, 'A Measuring Technology,' Youngji Munhwasa, p. 73, pp. 158-165 |
4 | Kook Nam Park, Jong Hark Park, Man Soon Cho, Chang Oong Choi, Seong Yoon Yoo, 1999, 'A Study on Cooling of the CNS Moderator in HANARO,' The Korea Institute of Applied Superconductivity and Cryogenics 1st Conference '99, pp. 177-181 |
5 | Man Soon Cho, Kook Nam Park, Byung Chuel Lee, Jae Min Sohn, Sang Jun Park, Chuel Muu Sim, Chang Oong Choi, 1999, 'Heat Load Measurement in the Vertical Hole for Installation of Hanaro CNS,' Proceeding of The 6th Asian Symposium on Research Reactor, JAERI-Conf 99-006, pp. 385-391 |
6 | Albert S. Birks, Robert E. Green Jr, Paul Mclntire, 1991, 'Nondestructive Testing Handbook' Vol. 7 Ultrasonic Testing, American Society for Non-destructive Testing, p. 198, p. 259, pp. 269-373 |
7 | Kook Nam Park, Chuel Muu Sim, Young Hyun Choi, Kil Mo Koo, Yoong Sup Lee, Chang Oong Choi, 1999, 'Measurement of Shape by Ultrasonic Waves and Surface Inspection of the Cold Neutron Source Vertical Hole,' KAERI/TR-1261/99 |
8 | Stefan Kocis, Zdenko Figura, 1996, 'Ultrasonic Measurements and Technologies,' Chapman & Hall, pp. 15-16 |
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