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Analysis of Factors Impacting Atmospheric Pressure Plasma Polishing  

Zhang, Ju-Fan (Center for Precision Engineering, Harbin institute of Technology)
Wang, Bo (Center for Precision Engineering, Harbin institute of Technology)
Dong, Shen (Center for Precision Engineering, Harbin institute of Technology)
Publication Information
Abstract
Atmospheric pressure plasma polishing (APPP) is a noncontact precision machining technology that uses low temperature plasma chemical reactions to perform atom-scale material removal. APPP is a complicated process, which is affected by many factors. Through a preliminary theoretical analysis and simulation, we confirmed that some of the key factors are the radio frequency (RF) power, the working distance, and the gas ratio. We studied the influence of the RF power and gas ratio on the removal rate using atomic emission spectroscopy, and determined the removal profiles in actual operation using a commercial form talysurf. The experimental results agreed closely with the theoretical simulations and confirmed the effect of the working distance. Finally, we determined the element compositions of the machined surfaces under different gas ratios using X-ray photoelectron spectroscopy to study the influence of the gas ratio in more detail. We achieved a surface roughness of Ra 0.6 nm on silicon wafers with a peak removal rate of approximately 32 $mm^{3}$/min.
Keywords
Atmospheric pressure plasma; Capacitance coupling; Impacting factor; Polishing; Ultrasmooth surface;
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Times Cited By KSCI : 3  (Citation Analysis)
Times Cited By Web Of Science : 4  (Related Records In Web of Science)
Times Cited By SCOPUS : 4
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1 Zhao, G. X., Li, Y. and Zheng, Y. N., "Discussion on the Principle of Ion Beam Removal Machining," EDM and Mould, Vol. 1, pp. 26-28, 2001
2 Mori, Y., Yamamura, K. and Endo, K., "Creations of Perfect Surfaces," Journal of Crystal Growth, Vol. 275, pp. 39-50, 2005   DOI
3 Zhang, J. F., Wang, B. and Dong, S., "The Design of an Atmospheric Pressure Plasma Torch Used for Polishing Ultra-Smooth Surfaces," Key Engineering Materials, Vol. 364-366, pp. 340-345, 2008   DOI
4 Jeong, H. C., Choi, G. M. and Kim, D. J., "The Precision of Lead Frame Etching Characteristics Using Monte-Carlo Simulations," International Journal of Precision Engineering and Manufacturing, Vol. 8, No. 1, pp. 73-78, 2007   과학기술학회마을
5 Dean, J. A., "Analytical Chemistry Handbook," Science Press, p. 7.1, 2003
6 Mori, Y., Yamauchi, K., Yamamura, K. and Sano, Y., "Development of Plasma Chemical Vaporization Machining," Review of Scientific Instruments, Vol. 71, No. 12, pp. 4627-4632, 2000   DOI   ScienceOn
7 Zhang, H., Wang, W. and Pang, Y. Y., "Ultra-precision Machining Technology of Optical Surfaces," Optical Instruments, Vol. 25, No. 3, pp. 47-51, 2003
8 Ke, Y. K. and Dong, H. R, "Analytical Chemistry Manual (III): Spectral Analysis," Journal of Crystal Growth, Vol. 275, pp. 39-50, 2005   DOI
9 Carter, L. E. and Carter, E. A., "F2 Reaction Dynamics with Defective Si (100): Defect-insensitive Surface Chemistry," Surface Science, Vol. 323, pp. 39-50, 1995   DOI
10 Yamamura, K., Kato, K., Sano, Y., Shibahara, M., Endo, K. and Mori, Y., "High-Spatial-Resolution Machining Utilizing Atmospheric Pressure Plasma: Machining Characteristics of Silicon," Japanese Journal of Applied Physics,Vol. 45, No. 10, pp. 8281-8285, 2006   DOI
11 Asai, T., Motoki, T., Gao, W., Ju, B. F. and Kiyono, S., "An AFM-based Edge Profile Measuring Instrument for Diamond Cutting Tools," International Journal of Precision Engineering and Manufacturing, Vol. 8, No. 2, pp. 54-58, 2007   과학기술학회마을
12 Detrick, M. S., Washington, G. N. and Subramaniam, V. V., "Control of Polishing of Diamond Films Using Microactuation and an Atmospheric Pressure Plasma," IEEE/ASME Transactions on Mechatronics, Vol. 8, No. 1, p. 45, 2003   DOI   ScienceOn
13 Carr, J. W., "Atmospheric Pressure Plasma Processing for Damage-free Optics and Surfaces," Engineering Research Development and Technology, Vol. 3, pp. 3-1-3-9, 1999
14 Shibahara, M. and Katsuki, M., "Molecular Dynamics Study of the Effects of Adsorbed Molecules on Reaction Probability and Energy Transfer," Combustion and Flame, Vol. 144, pp. 17-23, 2006   DOI   ScienceOn
15 Li, B. G., Xiong, C. Y. and Li, C. G., "Machining Technology of Super Smooth Surface," Manufacturing Technology & Machine Tools, No. 6, pp. 60-66, 2006
16 Alagumurthi, N., Palaniradja, K. and Soundararajan, V., "Cylindrical Grinding - A Review on Surface Integrity," International Journal of Precision Engineering and Manufacturing, Vol. 8, No. 3, pp. 24-44, 2007   과학기술학회마을
17 Wang, B., Zhao, Q. L., Wang, L. P. and Dong, S., "Application of Atmospheric Pressure Plasma in the Ultrasmooth Polishing of SiC Optics," Materials Science Forum, Vol. 532-533, pp. 504-507, 2006   DOI
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