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In-Plane Deformation Analysis and Design of Experiments Approach for Injection Molding of Light Guide Plate for LCDs  

Lee Ho-Sang (Department of Mechanical Design Engineering, Chungju National University)
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Abstract
A computer code was developed to simulate both the thermal stresses introduced during the post-filling stage and the in-plane deformation after ejection process by finite element method based on the plane stress theory. The computer simulation was applied to the mold design of a 2 inch light guide plate (LGP) for thin film transistor (TFT)-liquid crystal displays (LCD). With injection molding experiments based on the design of experiments (DOE) technique, the influences of the processing conditions in injection molding on brightness and uniformity of the LGP were investigated, and the optimal processing parameters were selected to increase the brightness and uniformity. The verification experiment showed that the brightness and uniformity of the LGP were increased dramatically under the selected optimal processing conditions.
Keywords
Injection Molding; Finite Element Analysis; Light Guide Plate; Design of Experiments; Brightness;
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1 Tamma, K.K. and Railkar, S.B., 'Evaluation of residual thermally induced stresses in the cooling of polymer melt via transfinite element computations,' Polymer Engineering and Science, Vol. 29, pp.100-106, 1989   DOI   ScienceOn
2 Chang, R.Y. and Tsaur, B.D., 'Experimental and Theoretical Studies of Shrinkage, Warpage, and Sink Marks of Crystalline Polymer Injection Molded Parts,' Polymer Engineering and Science, Vol.35, pp. 1222-1230, 1995   DOI   ScienceOn
3 Santhanam, N., Chiang, H.H., Himasekhar, K., Tuschak, P. and Wang, K.K., 'Postmolding and Loas-Induced Deformation Analysis of Plastic Parts in the Injection Molding Process,' Advances in Polymer Technology, Vol. 11, 77-89, 1992   DOI
4 Liu, S.J., 'Modeling and Simulation of Thermally Induced Stress and Warpage in Injection Molded Thermoplastics,' Polymer Engineering and Science, Vol.36, pp. 807-818, 1996   DOI
5 Lee, H.S., 'In-Plane Deformation Analysis of Plastic Parts in the Injection Molding Process,' Journal of Injection Molding Technology, Vol. 3, No. 1, pp. 11-20, 1999
6 Lee, E.H. and Rogers, T.G., 'Solution of Viscoelastic Stress Analysis Problems Using Measured Creep or Relaxation Functions,' Journal of Applied Mechanics, Vol.30, pp. 127-133, 1963   DOI
7 Rezayat, M. and Stafford, R.O., 'A Thermoviscoelastic Model for Residual Stress in Injection Molded Thermoplastics,' Polymer Engineering and Science, Vol.31, pp. 393-398, 1991   DOI
8 Jacques, M. St., 'An analysis of thermal warpage in injection molded flat parts due to unbalanced cooling,' Polymer Engineering and Science, Vol. 22, pp. 241, 1982   DOI
9 Tamma, K.K., Dowler, B.L. and Railkar, S.B., 'Computer Aided Applications to Injection Molding : Transfinite/Finite Element Thermal Stress Response Formulations,' Polymer Engineering and Science, Vol. 28, pp. 421-428, 1988   DOI   ScienceOn
10 Phillip, R., Taguchi Techniques for Quality Engineering; McGraw-Hill Int, 1996
11 C-MOLD Shrinkage & Warpage User's Guide, AC Technology, 1999
12 Hieber, C.A. and Shen, S.F., 'A Finite-Element/Finite- Difference Simulation of the Injection Mold Filling Process,' J Non-Newt Fluid Mech , Vol. 7, pp.1-32, 1980   DOI   ScienceOn
13 Chiang, H.H., Hieber, N. and Wang, K.K., 'A Unified Simulation of the Filling and Postfilling Stages in Injection Molding, partI: Formulation and part II: Experimental Verification,' Polymer Engineering and Science, Vol.31, pp. 116-125, 1991   DOI
14 Chang, R.Y. and Chiou, S.Y., 'A Unified K-BKZ Model for Residual Stress Analysis of Injection Molded Three-Dimensional Thin Shapes,' Polymer Engineering and Science, Vol.35, pp. 1733-1747, 1995   DOI