1 |
Y. Guo, A. Klink, C. Fu, J. Snyder, CIRP Annals, 2013, 62(1), 83-86.
DOI
|
2 |
D.S. Jin, K.H. Chun, E.S. Lee, CJA, 2017, 30(3), 1231-1241.
|
3 |
S.H. Kim, S.G. Choi, W.K. Choi, B.Y. Yang, E.S. Lee, Applied Surface Sci, 2014, 314, 822-831.
DOI
|
4 |
W.J. Song, E.S. Lee., J. Korean Soc. Manuf. Process. Eng, 2017, 16(5), 141-149.
|
5 |
S.G. Choi, S.H. Kim ,W.K. Choi, E.S. Lee, IJAMT, 2016, 82(9-12), 1933-1939.
|
6 |
T.N. Tsai, M.L. Applied Soft Comp, 2016, 48, 124-136.
DOI
|
7 |
J.K. Kim, B.D. Kim, D.W. Yoon, J.W. Choi. J. Korean Ins. Infor. Tech, 2016, 14(12), 107-115.
|
8 |
S. Ranganathan, T. Senthilvelan & G. Sriram, Materials. Manuf. Process, 2010, 25(10), 1131-1141.
DOI
|
9 |
M.S. Sukumar, P. Venkata Ramaiah, A. Nagarjuna, Procedia Eng, 2014, 97, 365-371.
DOI
|
10 |
Z. Chen, S. Deng, X. Chen, C.Li, R.V. Sanchez, H. Qin, Microelectronics Reliability, 2017, 75, 327-333.
DOI
|
11 |
Z. Yin, J. Zhang, Neurocomputing, 2018, 283, 266-281.
DOI
|
12 |
S. A, Acta Polytec. Hungarica, 2011, 8(2), 22-32.
|