Browse > Article
http://dx.doi.org/10.33961/jecst.2019.03174

Prediction and Comparison of Electrochemical Machining on Shape Memory Alloy(SMA) using Deep Neural Network(DNN)  

Song, Woo Jae (Graduate School of Metal Materials and Machining Process Engineering, Inha University)
Choi, Seung Geon (School of Mechanical Engineering, Inha University)
Lee, Eun-Sang (Department of Mechanical Engineering, Inha University)
Publication Information
Journal of Electrochemical Science and Technology / v.10, no.3, 2019 , pp. 276-283 More about this Journal
Abstract
Nitinol is an alloy of nickel and titanium. Nitinol is one of the shape memory alloys(SMA) that are restored to a remembered form, changing the crystal structure at a given temperature. Because of these unique features, it is used in medical devices, high precision sensors, and aerospace industries. However, the conventional method of mechanical machining for nitinol has problems of thermal and residual stress after processing. Therefore, the electrochemical machining(ECM), which does not produce residual stress and thermal deformation, has emerged as an alternative processing technique. In addition, to replace the existing experimental planning methods, this study used deep neural network(DNN), which is the basis for AI. This method was shown to be more useful than conventional method of design of experiments(RSM, Taguchi, Regression) by applying deep neural network(DNN) to electrochemical machining(ECM) and comparing root mean square errors(RMSE). Comparison with actual experimental values has shown that DNN is a more useful method than conventional method. (DOE - RSM, Taguchi, Regression). The result of the machining was accurately and efficiently predicted by applying electrochemical machining(ECM) and deep neural network(DNN) to the shape memory alloy(SMA), which is a hard-mechinability material.
Keywords
Electrochemical Machining(ECM); Shape Memory Ally(SMA); Deep Neural Network(DNN);
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Y. Guo, A. Klink, C. Fu, J. Snyder, CIRP Annals, 2013, 62(1), 83-86.   DOI
2 D.S. Jin, K.H. Chun, E.S. Lee, CJA, 2017, 30(3), 1231-1241.
3 S.H. Kim, S.G. Choi, W.K. Choi, B.Y. Yang, E.S. Lee, Applied Surface Sci, 2014, 314, 822-831.   DOI
4 W.J. Song, E.S. Lee., J. Korean Soc. Manuf. Process. Eng, 2017, 16(5), 141-149.
5 S.G. Choi, S.H. Kim ,W.K. Choi, E.S. Lee, IJAMT, 2016, 82(9-12), 1933-1939.
6 T.N. Tsai, M.L. Applied Soft Comp, 2016, 48, 124-136.   DOI
7 J.K. Kim, B.D. Kim, D.W. Yoon, J.W. Choi. J. Korean Ins. Infor. Tech, 2016, 14(12), 107-115.
8 S. Ranganathan, T. Senthilvelan & G. Sriram, Materials. Manuf. Process, 2010, 25(10), 1131-1141.   DOI
9 M.S. Sukumar, P. Venkata Ramaiah, A. Nagarjuna, Procedia Eng, 2014, 97, 365-371.   DOI
10 Z. Chen, S. Deng, X. Chen, C.Li, R.V. Sanchez, H. Qin, Microelectronics Reliability, 2017, 75, 327-333.   DOI
11 Z. Yin, J. Zhang, Neurocomputing, 2018, 283, 266-281.   DOI
12 S. A, Acta Polytec. Hungarica, 2011, 8(2), 22-32.