Electrochemical Deposition of Copper on Polymer Fibers |
Lim, Seung-Lin
(Departmaent of Energy & Materials Engineering, Dongguk University)
Kim, Jaecheon (Departmaent of Energy & Materials Engineering, Dongguk University) Park, Jongdeok (Departmaent of Energy & Materials Engineering, Dongguk University) Kim, Sohee (Nanotechnology Research Centre & Department of Applied Chemistry, Konkuk University) Lee, Jae-Joon (Departmaent of Energy & Materials Engineering, Dongguk University) |
1 | C.-W. Park, Y.-H. Yoon and J. Hwang, PAAR, 2010, 6(2), 69-80. |
2 | H. Zhang, X. Zou and J. Sun, J. Compos. Mater., 2012, 46(24), 3001-3009. DOI |
3 | G. Venkatachalam, S. Kanthikeyan, M. Hitharth, K. Sumanjeet and S. Narayanan, Int. J. ChemTech Res., 2013, 5(1), 237-245. |
4 | J. Li and P. A. Kohl, J. Electrochem. Soc., 2002, 149(12), C631-C636. DOI |
5 | M. L. Bosko, F. A. Marchesini, L. M. Corraglia and E. E Miró, Catal. Today, 2013, 212, 16-22. DOI |
6 | W. Kang, Q. Li, B. Cheng, Y. Ren and X. Zhuang, 3rd International Nanoelectronics Conference (INEC); 2010 Jan. 3-8, IEEE, 415-416. |
7 | K. G. Mishra, and R. K. Paramguru, Afr. J. Pure Appl. Chem., 2010, 4(6), 87-99. |
8 | B. Kim, S. H. Jung, S. W. Suh and B. K. Park, J. Nanosci. Nanotechnol., 2013, 13, 517-522. DOI |
9 | Y. Lu, Q. Liang and L. Xue, Appl. Surf. Sci., 2012, 258, 4782-4787. DOI |
10 | L.-S. Son, H.-N. Lee and H.-K. Lee, J. Kor. Inst. Surf. Eng., 2012, 45(1), 8-14. DOI |
11 | R. H. Guo, S. Q. Jiang, C. W. M. Yuen, and M. C. F. Ng, J. Mater. Sci.: Mater. Electron, 2009, 20, 33-38. |
12 | L.-S. Li, X.-R. Li, W.-X. Zhao, Q. Ma, X.-B. Lu, and Z.-L. Wang, Int. J. Electrochem. Sci., 2013, 8, 5191-5202. |
13 | Y. Wang, C. Bian, and X. Jing, Appl. Surf. Sci., 2013, 271, 303-310. DOI |
14 | J. J. Kelly, C. Tian, and A. C. West, J. Electrochem. Soc., 1999, 146(7), 2540-2545. DOI |
15 | W.-P. Dow, and H.-H. Chen, Circuit World, 2004, 30(3), 33-36. DOI |
16 | S. B. Yang, B. K. Min, S. D. Choi, and H. J. Shin, J. Korean Inst. surf. Eng., 2001, 34(3), 215-224. |
17 | R. H. Guo, S. X. Jiang, C. W. M. Yuen, M. C. F. Ng, J. W. Lan, Y. L. Yeung, and S. J. Lin, Fibers and Polymers, 2013, 14(5), 752-758. DOI |
18 | I. S. Oh, J. D. Park, and Y. H. Bai, J. Korean Soc. Power Sys. Eng., 2001, 5(2), 71-78. |
19 | M. A. Dinderman, W. J. Dressiok, C. N. Kostelansky, R. R. Price, S. B. Qadri, and P. E. Schoen, Chem. Mater., 2006, 18, 4361-4368. DOI |
20 | P. M. Vereecken, R. A. Binstead, H. Deligianni, and P. C. Andricacos, IBM J. RES & DEV., 2005, 49(1), 3-18. DOI |
21 | W.-P. Dow, H.-S. Huang, and Z. Lin, Electrochem. Solid-state Lett., 2003, 6(9), C134-C136. DOI |
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