1 |
S. Boughaba, M. Islam, J. P. McCaffrey, G. I. Sproule, and M.J. Graham, Thin Solid Films 371, 119 (2000).
DOI
ScienceOn
|
2 |
P. C. Joshi and M. W. Cole, J. Appl. Phys. 86, 871 (1999).
DOI
|
3 |
Y. Nakagawa and T. Okada, J. Appl. Phys. 68, 556 (1990).
DOI
|
4 |
S. Tanimoto, M. Matsui, K. Kamisako, K. Kuroiwa, and Y. Tarui, J. Electrochem. Soc. 139, 320 (1992).
DOI
|
5 |
Y. Nishimura, K. Tokunaga, and M. Tsuji, Thin Solid Films 226, 144 (1993).
DOI
ScienceOn
|
6 |
K. W. Kwon, C. S. Kang, S. O. Park, H. K. Kang, and S. T. Ann, IEEE Trans. Electron Devices 43, 919 (1996).
DOI
ScienceOn
|
7 |
J. Y. Zhang, B. Lim, V. Dusastre, and I. W. Boyd, Appl. Phys. Lett. 73, 2299 (1998).
DOI
ScienceOn
|
8 |
Y. Yang, P. Sheridan, and W. Lu, Appl. Phys. Lett. 100, 203112 (2012).
DOI
ScienceOn
|
9 |
M. Vehkamaki, T. Hatanpaa, T. Hanninen, M. Ritala, and M. Leskela, Electrochem. Solid-State Lett., 2, 504 (1999).
DOI
|
10 |
T. Suntola, Thin Solid Films 216, 84 (1992).
DOI
ScienceOn
|
11 |
J. Aarik, A. Aidla, T. Uustare, and V. Sammelselg, J. Crystal Growth 148, 268 (1995).
DOI
ScienceOn
|
12 |
D. M. Hausmann, P. de Rouffignac, A. Smith, R. Gordon, and D. Monsma, Thin Solid Films 443, 1 (2003).
DOI
ScienceOn
|
13 |
J. Y. Zhang, B. Hopp, Z. Geretovszky, and I. W. Boyd, Appl. Surf. Sci. 168, 307 (2000).
DOI
ScienceOn
|
14 |
M. Tsuchiya, S.K.R.S. Sankaranarayanan, and S. Ramanathan, Prog. Mater. Sci. 54, 981 (2009).
DOI
ScienceOn
|
15 |
C. C. Lee, J. C. Hsu, and D. H. Wong, Appl. Surf. Sci. 171, 151 (2001).
DOI
ScienceOn
|
16 |
Y. M. Li and L. Young, Electrochim. Acta 44, 605 (1998).
DOI
ScienceOn
|
17 |
W. Kulisch, D. Gilliland, G. Ceccone, H. Rauscher, L. Sirghi, P. Colpo, and F. Rossi, J. Vac. Sci. Technol. A 26, 991 (2008).
DOI
ScienceOn
|
18 |
J. J. Randle, W. J. Bernard, and R. R. Wilkinson, Electrochim. Acta 10, 183 (1965).
DOI
ScienceOn
|
19 |
C. J. Dell'Oca and L. Young, J. Electrochem. Soc. 117, 1548 (1970).
DOI
|
20 |
J. D. Sloppy, N. J. Podraza, E. C. Dickey, and D. D. Macdonald, Electrochim. Acta 55, 8751 (2010).
DOI
ScienceOn
|
21 |
Y. Kim, J. Zhao, and K. Uosaki, J. Appl. Phys. 94, 7733 (2003).
DOI
ScienceOn
|
22 |
V. Macagno and J. W. Schultze, J. Electroanal. Chem. 180, 157 (1984).
DOI
ScienceOn
|
23 |
O. Kerrec, D. Devilliers, H. Groult, and P. Marcus, Mat. Sci. and Eng. B 55, 134 (1998).
DOI
ScienceOn
|
24 |
S. Lecuyer, A. Quemerais, and G. Jezequel, Surf. Interface Anal. 18, 257 (1992).
DOI
|
25 |
F. Di Franco, M. Santamaria, F. Di Quarto, E. Tsuji, and H. Habazaki, Electrochim. Acta 59, 382 (2012).
DOI
ScienceOn
|
26 |
Q. Lu, S. Mato, P. Skeldon, G. E. Thompson, and D. Masheder, Thin Solid Films 429, 238 (2003).
DOI
ScienceOn
|
27 |
O. Kerrec, D. Devilliers, H. Groult, and M. Chemla, Electrochimica Acta. 40, 719 (1995).
DOI
ScienceOn
|
28 |
G. E. Cavigliasso, M. J. Esplandiu, and V. A. Macagno, J. Appl. Electrochem. 28, 1213 (1998).
DOI
ScienceOn
|
29 |
F. Di Quarto, S. Piazza, and C. Sunseri, Electrochimca. Acta 35, 99 (1990).
DOI
ScienceOn
|
30 |
Impedance Spectroscopy, J. R. Macdonald ed., p. 90, John Wiley & Sons, New York (1987).
|
31 |
M. Tomkiewicz, J. Electrochem. Soc. 126, 2220 (1979).
DOI
|
32 |
Y. M. Li and L. Young, J. Electrochem. Soc. 147, 1344 (2000).
DOI
ScienceOn
|
33 |
C. J. Dell'Oca, D. J. Pulfrey, and L. Young, in Physics of Thin Films, M. H. Francombe and R. W. Hoffmann ed., Vol. 6, Academic, New York and London (1971).
|