Browse > Article
http://dx.doi.org/10.6109/jicce.2016.14.4.252

Suppression of Parallel Plate Modes Using Edge-Located EBG Structure in High-Speed Power Bus  

Cho, Jonghyun (Missouri S&T EMC Laboratory, Missouri University of Science and Technology)
Kim, Myunghoi (Department of Electrical, Electronic, and Control Engineering, Hankyong National University)
Abstract
An edge-located electromagnetic bandgap (EL-EBG) structure using a defected ground structure (DGS) is proposed to suppress resonant modes induced by edge excitation in a two-dimensional planar parallel plate waveguide (PPW). The proposed EL-DGS-EBG PPW significantly mitigates multiple transverse-magnetic (TM) modes in a wideband frequency range corresponding to an EBG stopband. To verify the wideband suppression, test vehicles of a conventional PPW, a PPW with a mushroom-type EBG structure, and an EL-DGS-EBG PPW are fabricated using a commercial process involving printed circuit boards (PCBs). Measurements of the input impedances show that multiple resonant modes of the previous PPWs are significantly excited through an input port located at a PPW edge. In contrast, resonant modes in the EL-DGS-EBG PPW are substantially suppressed over the frequency range of 0.5 GHz to 2 GHz. In addition, we have experimentally demonstrated that the EL-DGS-EBG PPW reduces the radiated emission from -24 dB to -44 dB as compared to the conventional PPW.
Keywords
Electromagnetic bandgap (EBG); Parallel plate waveguide (PPW); Radiated emission;
Citations & Related Records
연도 인용수 순위
  • Reference
1 M. I. Montrose, E. P. Li, H. F. Jin, and W. L. Yuan, "Analysis on the effectiveness of the 20-H rule for printed-circuit-board layout to reduce edge-radiated coupling," IEEE Transactions on Electromagnetic Compatibility, vol. 47, no. 2, pp. 227-233, 2005.   DOI
2 K. B. Wu, R. B. Wu, and D. De Zutter, "Modeling and optimal design of shorting vias to suppress radiated emission in high-speed alternating PCB planes," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 4, pp. 566-573, 2011.   DOI
3 R. Abhari and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Transactions on Microwave Theory and Techniques, vol. 51, no. 6, pp. 1629-1639, 2003.   DOI
4 S. Shahparnia and O. M. Ramahi, "Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures," IEEE Transactions on Electromagnetic Compatibility, vol. 46, no. 4, pp. 580-587, 2004.   DOI
5 M. Kim, K. Koo, C. Hwang, Y. Shim, J. Kim, and J. Kim, "A compact and wideband electromagnetic bandgap structure using a defected ground structure for power/ground noise suppression in multilayer packages and PCBs," IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 3, pp. 689-695, 2012.   DOI
6 Electromagnetic Compatibility (EMC) - Part 4-21: Testing and measurement techniques - Reverberation chamber test methods, IEC 61000-4-21:2011, 2011.
7 J. Kim, H. Kim, and J. Kim, "Efficient on-chip decoupling capacitor design on an 8-bit microcontroller to reduce simultaneous switching noise and electromagnetic radiated emission," IEICE Transactions on Communications, vol. 86, no. 6, pp. 2077-2080, 2003.
8 M. Swaminathan, J. Kim, I. Novak, and J. P. Libous, "Power distribution networks for system-on-package: status and challenges," IEEE Transactions on Advanced Packaging, vol. 27, no. 2, pp. 286-300, 2004.   DOI
9 T. Sudo, H. Sasaki, N. Masuda, and J. L. Drewniak, "Electromagnetic interference (EMI) of system-on-package (SOP)," IEEE Transactions on Advanced Packaging, vol. 27, no. 2, pp. 304-314, 2004.   DOI
10 T. H. Hubing, J. L. Drewniak, T. P. Van Doren, and D. M. Hockanson, "Power bus decoupling on multilayer printed circuit boards," IEEE Transactions on Electromagnetic Compatibility, vol. 37, no. 2, pp. 155-166, 1995.   DOI
11 J. S. Pak, H. Kim, J. Lee, and J. Kim, "Modeling and measurement of radiated field emission from a power/ground plane cavity edge excited by a through-hole signal via based on a balanced TLM and via coupling model," IEEE Transactions on Advanced Packaging, vol. 30, no. 1, pp. 73-85, 2007.   DOI
12 H. Sasaki, T. Harada, and T. Kuriyama, "A new decoupling technique for suppressing radiated emissions arising from power bus resonance of multilayer PCBs," in Proceedings of 1999 International Symposium on Electromagnetic Compatibility, Tokyo, Japan, pp. 17-20, 1999.
13 H. Sasaki, T. Harada, and T. Kuriyama, "A new VLSI decoupling circuit for suppressing radiated emissions from multilayer printed circuit boards," in Proceedings of IEEE International Symposium on Electromagnetic Compatibility, Washington, DC, pp. 157-162, 2000.